OM6206 NXP Semiconductors, OM6206 Datasheet - Page 25

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OM6206

Manufacturer Part Number
OM6206
Description
65 X 102 Pixels Matrix Lcd Driver
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
The required minimum value for the external capacitors in
an application with the OM6206 are:
Higher capacitor values are recommended for ripple
reduction.
13.3
The pinning of the OM6206 is optimized for single plane
wiring e.g. for Chip-On-Glass (COG) display modules with
display size of 65
14 BONDING PAD INFORMATION
2001 Nov 14
RES_B
row32
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row19
dummy pad
dummy pad
row0
row1
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row9
C
C
65
SYMBOL
VLCD
VDD
Application for COG
, C
> 100 F
102 pixels matrix LCD driver
VDD1
and C
102 pixels.
PAD
VDD2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
> 1 F
COORDINATES
3870
4270
4340
4410
4480
4550
4620
4690
4760
4830
4900
4970
5040
5110
5180
5320
5355
5005
4935
4865
4795
4725
4655
4585
4515
4445
4375
x
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
935
935
935
935
935
935
935
935
935
935
935
y
(1)
25
To reduce the sensitivity of a reset to ESD/EMC
disturbances for a chip-on-glass application, it is strongly
recommended to implement on the glass (indium track
resistance) a series input resistance in the reset line
(recommended minimum value of 8 k ).
13.4
The OM6206 is manufactured in n-well CMOS technology.
The substrate is on V
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col0
col1
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col10
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col17
col18
SYMBOL
Chip information
PAD
SS
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
potential.
COORDINATES
4305
4235
4165
4095
4025
3955
3885
3815
3745
3605
3535
3465
3395
3325
3255
3185
3115
3045
2975
2905
2835
2765
2695
2625
2555
2485
2415
2345
x
Product specification
OM6206
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
935
y
(1)

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