OM6206 NXP Semiconductors, OM6206 Datasheet - Page 28
OM6206
Manufacturer Part Number
OM6206
Description
65 X 102 Pixels Matrix Lcd Driver
Manufacturer
NXP Semiconductors
Datasheet
1.OM6206.pdf
(36 pages)
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Philips Semiconductors
Note
1. All x/y coordinates (in m) are referenced to the centre
2001 Nov 14
V
V
V
V
V
V
T1
T5
T4
V
V
T3
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Alignment marks
Circle 1
Circle 2
Circle 3
Circle 4
SS2
SS2
SS1
SS1
SS1
SS1
SS1
SS1
LCDIN
LCDIN
LCDIN
LCDIN
LCDIN
LCDIN
LCDOUT
LCDOUT
LCDOUT
LCDOUT
LCDOUT
LCDOUT
LCDOUT
LCDSENSE
65
SYMBOL
of the chip (see Fig.20).
102 pixels matrix LCD driver
PAD
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
+5185
+4160
COORDINATES
1150
1630
2030
2110
2190
2270
2510
2590
2670
2750
2830
2910
3070
3150
3230
3310
3390
3470
3550
3630
5185
4160
430
510
670
750
830
910
x
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+935
+910
+910
910
910
y
(1)
28
Table 9 Bonding pad dimensions
Pad pitch
Pad size, aluminium
Bump dimensions
Wafer thickness (including
bumps)
Wafer thickness (without
bumps)
NAME
70 m
62
50
maximum 430 m
typical 380 m
100 m
90
Product specification
DIMENSION
17.5 ( 5) m
OM6206
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