MCIMX31 Motorola Semiconductor Products, MCIMX31 Datasheet - Page 12

• Manufacturer Part Number: MCIMX31
• Manufacturer: Motorola Semiconductor Products

Electrical Characteristics
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1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
2. Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6.
3. Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board
4. Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The
5. Thermal characterization parameter indicating the temperature difference between the package
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
Thermal test board meets JEDEC specification for this package.
meets JEDEC specification for the specified package.
cold plate temperature is used for the case temperature. Reported value includes the thermal
resistance of the interface layer.
top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
MCIMX31/MCIMX31L Advance Information, Rev. 3.2
Preliminary—Subject to Change Without Notice
NOTES
Freescale Semiconductor