MD3331-D32-V3Q18 M-Systems Inc., MD3331-D32-V3Q18 Datasheet
MD3331-D32-V3Q18
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MD3331-D32-V3Q18 Summary of contents
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Data Sheet Mobile DiskOnChip 1.8V I/O Flash Disk, Protection and Security-Enabling Features Highlights Mobile DiskOnChip Plus 16/32MByte (128/256Mbit) is one of the industry’s most efficient storage solutions, with the fastest write rates, the smallest size and lowest power consumption. Additionally, ...
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Reliability On-the-fly Reed-Solomon Error Detection Code/Error Correction Code (EDC/ECC) Guaranteed data integrity, even after power failure Transparent bad-block management Dynamic and static wear-leveling Hardware Compatibility Configurable interface: simple SRAM-like or multiplexed A/D interface Compatible with all major CPUs, including: ARM-based ...
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Introduction ......................................................................................................................... 7 2. Product Overview ................................................................................................................ 8 2.1 Product Description ...................................................................................................................... 8 2.2 Standard Interface ........................................................................................................................ 9 2.2.1 Ball Diagram.............................................................................................................................. 9 2.2.2 System Interface ..................................................................................................................... 10 2.2.3 Signal Description ................................................................................................................... 11 2.3 Multiplexed Interface................................................................................................................... 13 2.3.1 Ball Diagram............................................................................................................................ ...
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Compatibility............................................................................................................................ 28 6.2 8KB Memory Window in Mobile DiskOnChip Plus 16MB........................................................... 29 6.3 8KB Memory Window for Mobile DiskOnChip Plus 32MB ......................................................... 30 7. Register Descriptions ....................................................................................................... 31 7.1 Definition of Terms...................................................................................................................... 31 7.2 Reset Values .............................................................................................................................. 31 7.3 ...
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Environmental Specifications ..................................................................................................... 48 10.1.1 Operating Temperature Ranges ............................................................................................. 48 10.1.2 Thermal Characteristics .......................................................................................................... 48 10.1.3 Humidity .................................................................................................................................. 48 10.1.4 Endurance............................................................................................................................... 48 10.2 Disk Capacity.............................................................................................................................. 48 10.3 Electrical Specifications .............................................................................................................. 49 10.3.1 Absolute Maximum Ratings .................................................................................................... 49 10.3.2 Capacitance ...
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Revision History Revision Date 1.7 February 2003 6 Description ID[0:1], AVD# and VCCQ - description detailed Ordering info table updated to reflect Pb-free ordering info Data Sheet, Rev. 1.7 Mobile DiskOnChip Plus 16/32MByte 1.8V I/O Reference Section 2.2.3 Section 11 ...
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Introduction This data sheet includes the following sections: Section 1: Overview of data sheet contents Section 2: Product overview, including a brief product description, pin and ball diagrams and signal descriptions Section 3: Theory of operation for the major ...
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Product Overview 2.1 Product Description Mobile DiskOnChip Plus 16/32MB is a member of M-Systems’ DiskOnChip product series based on a single die (16MB) or dual die (32MB) with an embedded flash controller and flash memory, providing ...
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Standard Interface 2.2.1 Ball Diagram See Figure 1 for the Mobile DiskOnChip Plus standard interface FBGA ball diagram. To ensure proper device functionality, balls marked RSRVD are reserved for future use and should not be connected ...
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System Interface See Figure 2 for a simplified I/O diagram for a standard interface. CE#, OE Host System Bus System Interface Figure 2: Standard Interface Simplified I/O Diagram 10 A[12:0] Mobile DiskOnChip Plus BHE# D[15:0] ID[1:0] IF_CFG ...
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Signal Description The ball designations are listed in the signal descriptions, presented in logic groups, in Table 1. Input Signal Ball No. Type A[12:11] D8, C8 A[10:8] F7, E7, C7 A[7:4] C3, D3, E3, F3 A[3:0] D2, E2, F2, ...
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Input Signal Ball No. Type VCC J5 VSS G3, J9 RSRVD K6 Other. See Figure The following abbreviations are used: IN Standard (non-Schmidt) input ST Schmidt Trigger input OD Open drain R8 Nominal 22 KΩ ...
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Multiplexed Interface 2.3.1 Ball Diagram See Figure 3 for the Mobile DiskOnChip Plus multiplexed interface FBGA ball diagram. To ensure proper device functionality, balls marked RSRVD are reserved for future use and should not be connected ...
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System Interface See Figure 4 for a simplified I/O diagram. Host System Bus Figure 4: Multiplexed Interface Simplified I/O Diagram 14 CE#, OE#, WE# Mobile DiskOnChip Plus AD[15:0] ID0 AVD# System Interface Configuration Data Sheet, Rev. 1.7 Mobile DiskOnChip ...
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Signal Description The ball designations are listed in the signal descriptions, presented in logic groups, in Table 2. Table 2: Multiplexed Interface Signal Descriptions Input Signal Ball No. Type AD[15:12] H8, K8, H7, J7, AD[11:8] K5, J4, H4, K3, ...
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Input Signal Ball No. Type RSRVD K6 Other. See Figure The following abbreviations are used: IN Standard (non-Schmidt) input ST Schmidt Trigger input OD Open drain R8 Nominal 22 KΩ pull-up resistor, enabled only for ...
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Theory of Operation 3.1 Overview Mobile DiskOnChip Plus consists of the following major functional blocks, as shown in Figure 5. • System Interface for host interface • Configuration Interface for configuring Mobile DiskOnChip Plus to operate in 8/16-bit mode, ...
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System Interface The system interface block provides an easy-to-integrate SRAM-like (also EEPROM-like) interface to Mobile DiskOnChip Plus, enabling it to interface with various CPU interfaces, such as a local bus, ISA bus, SRAM interface, EEPROM interface or any other ...
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Unique Identification (UID) Number Each Mobile DiskOnChip Plus is assigned a 16-byte UID number. Burned onto the flash during production, the UID cannot be altered and is unique worldwide. The UID is essential in security-related applications, and can be ...
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Error Detection Code/Error Correction Code (EDC/ECC) NAND flash, being an imperfect memory, requires error handling. Mobile DiskOnChip Plus implements Reed-Solomon Error Detection Code (EDC). A hardware-generated, 6-byte error detection signature is computed each time a page (512 bytes) is ...
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Mobile DiskOnChip Plus 32MB consists of two stacked 16MB devices, each designed with a single-bank 16MB flash array, consisting of 1024 blocks organized in 32 pages. 21 Mobile DiskOnChip Plus 16/32MByte 1.8V I/O 512 Bytes 16 Bytes Figure 7: Block ...
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Hardware Protection 4.1 Method of Operation Mobile DiskOnChip Plus enables the user to define two partitions that are protected (in hardware) against any combination of read or write operations. The two protected areas can be configured as read protected ...
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Low-Level Structure of the Protected Area The first three blocks on Mobile DiskOnChip Plus contain foundry information, the Data Protect structures, IPL code, and bad-block mapping information. See Figure 8. Bad Block Table and Factory-Programmed UID Data Protect Structure ...
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Modes of Operation Mobile DiskOnChip Plus has three modes of operation: • Reset • Normal • Deep Power-Down Mode changes can occur due to any of the following events, as shown in Figure 9: • Assertion of the RSTIN# ...
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Normal Mode This is the mode in which standard operations involving the flash memory are performed. Normal mode is automatically entered when a valid write sequence is sent to the DiskOnChip Control register and Control Confirmation register. The boot ...
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TrueFFS Technology 6.1 General Description M-Systems’ patented TrueFFS technology was designed to maximize the benefits of flash memory while overcoming inherent flash limitations that would otherwise reduce its performance, reliability and lifetime. TrueFFS emulates a hard disk, making it ...
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TrueFFS Software Development Kit (SDK) The basic TrueFFS Software Development Kit (SDK) provides the source code of the TrueFFS driver. It can be used in an OS-less environment or when special customization of the driver is required for proprietary ...
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Static Wear-Leveling Areas on the flash media may contain static files, characterized by blocks of data that remain unchanged for very long periods of time, or even for the whole device lifetime. If wear-leveling were only applied on newly written ...
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Memory Window in Mobile DiskOnChip Plus 16MB TrueFFS utilizes an 8KB memory window in the CPU address space consisting of four 2KB sections, as depicted in Figure 11. When in Reset mode, the Programmable Boot Block in sections ...
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Memory Window for Mobile DiskOnChip Plus 32MB TrueFFS utilizes an 8KB memory window in the CPU address space consisting of four 2KB sections, as depicted in Figure 11. When in Reset mode, the Programmable Boot Block in sections ...
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Register Descriptions This section describes various Mobile DiskOnChip Plus registers and their functions, as listed in Table 3. This section can be used to enable the designer to better evaluate DiskOnChip technology. Address (Hex) 7.1 Definition of Terms The ...
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No Operation (NOP) Register Description: A call to this register results in no operation. To aid in code readability and documentation, software should access this register when performing cycles intended to create a time delay. Address (hex): 1002 Type: ...
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DiskOnChip Control Register/Control Confirmation Register Description: These two registers are identical and contain information on the operation mode of Mobile DiskOnChip Plus. After writing the required value to the DiskOnChip Control register, the complement of that data byte must ...
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Device ID Select Register Description cascaded configuration, this register controls which device provides the register space. The value of bits ID[0:1] is compared to the value of the ID configuration input balls, as defined in Section 9.6. ...
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Output Control Register Description: This register controls the behavior of certain output balls. Address (hex): 100C Type: Read/Write Reset Value: 01H Bit 7 Bit 6 RFU_0 Bit No. 0-2, 4-7 Reserved for future use. 3 SLOCK [Sticky Lock]. Setting ...
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IRQ# output and permits subsequent interrupts to occur. 6 IRQ_P (Interrupt Request on Protection Violation). Indicates that the IRQ# output has been asserted due to a data protection violation. Writing this bit clears its value, ...
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Booting from Mobile DiskOnChip Plus 8.1 Introduction Mobile DiskOnChip Plus can function both as a flash disk and the system boot device. If DiskOnChip is configured as a flash disk, it can operate as the OS boot device. DiskOnChip ...
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The drive letter assigned depends on how Mobile DiskOnChip Plus is used in the system, as follows: • If Mobile DiskOnChip Plus is used as the only disk in the system, the system boots directly from it and assigns it ...
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Using Mobile DiskOnChip Plus in Asynchronous Boot Mode Platforms that host CPUs that wake up in burst mode should use Asynchronous Boot mode when using Mobile DiskOnChip Plus as the system boot device. During platform initialization, certain CPUs wake ...
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Design Considerations 9.1 Design Environment Mobile DiskOnChip Plus provides a complete design environment consisting of: • Evaluation Boards (EVB) for enabling software integration and development with Mobile DiskOnChip Plus, even before the target platform is available. An EVB with ...
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System Interface 9.2.1 Standard Interface Mobile DiskOnChip Plus uses an SRAM-like interface that can easily be connected to any microprocessor bus. With a standard interface, it requires 13 address lines, 8 data lines and basic memory control signals (CE#, ...
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Multiplexed Interface With a multiplexed interface, Mobile DiskOnChip Plus requires the signals shown in Figure 15 below. 0.1 uF Address/Data AVD# Output Enable W rite Enable Chip Enable Reset Chip ID 9.3 Connecting Signals 9.3.1 Standard Interface Mobile DiskOnChip ...
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Mobile DiskOnChip Plus derives its internal clock signal from the CE#, OE# and WE# inputs. Since access to Mobile DiskOnChip Plus’ registers is volatile, much like a FIFO or UART, ensure that these signals have clean rising and falling edges, ...
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The OS either returns control immediately to the TrueFFS driver, or waits for the appropriate condition to return control to the TrueFFS driver. For further information on implementing the interrupt mechanism, please refer to application note AP-DOC-063, Improving the ...
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No data is transferred when both BHE# and A0 are logic 1. • 16-bit hosts that do not support byte transfers may hardwire the A0 and BHE# inputs to logic 0. Table 4 shows the active data bus lanes ...
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Device Cascading 9.6.1 Standard Interface When using a standard interface four Mobile DiskOnChip Plus 16MB two Mobile DiskOnChip Plus 32MB devices can be cascaded, for up to 64MB capacity. No external decoding circuitry or ...
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Memory Map in a Cascaded Configuration When cascading Mobile DiskOnChip Plus devices, the Programmable Boot Block size is enlarged by 1KB for each additional 16MB device in the configuration. When four 16MB devices (or two 32MB devices) are connected ...
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Product Specifications 10.1 Environmental Specifications 10.1.1 Operating Temperature Ranges Commercial Temperature Range: 0°C to 70°C Extended Temperature Range: 10.1.2 Thermal Characteristics Junction to Case (θ 10.1.3 Humidity 10% to 90% relative, non-condensing. 10.1.4 Endurance Mobile DiskOnChip Plus is based ...
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Electrical Specifications 10.3.1 Absolute Maximum Ratings Parameter DC Core Supply Voltage DC I/O Supply Voltage Input Pin Voltage Input pin Current Storage Temperature Lead Temperature Maximum duration of applying VCCQ without VCC or VCC without VCCQ 1. Permanent device ...
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DC Electrical Characteristics Over Operating Range Table 11: DC Characteristics, 1.65V to 1.95V I/O Parameter Symbol Core Supply Voltage I/O Supply Voltage VCCQ High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage 1,2 Input Leakage Current ...
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Parameter Symbol Core Supply Voltage I/O Supply Voltage VCCQ High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage High-level Output Current I Low-level Output Current I 1, Input Leakage Current Output Leakage Current 3 Active Supply Current ...
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AC Operating Conditions Environmental and timing specifications are based on the following conditions. Parameter Ambient Temperature (TA) Supply Voltage Input Pulse Levels Input Rise and Fall Times Input Timing Levels Output Timing Levels Output Load 52 Mobile DiskOnChip Plus ...
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Timing Specifications 10.4.1 Read Cycle Timing Standard Interface A[12:0], BHE# CE# T (CE1) HO OE# WE# D[15:0] Figure 19: Standard Interface Read Cycle Timing T SU A[12:0], BHE# CE# T (CE1) HO OE# WE# D[15:0] Figure 20: Standard Interface ...
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Table 14: Standard Interface Read Cycle Timing Parameters (VCC=2.5-3.6V) Symbol Tsu(A) Address to OE# Tho(A) OE# to Address hold time Tsu(CE0) CE# to OE# Tho(CE0) OE# to CE# Tho(CE1) OE# or WE# Tsu(CE1) CE# to WE# Trec(OE) OE# negated to ...
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The boot block is located at addresses 0000~07FFH and 1800H~1FFFH. Registers located at addresses 0800H~17FFH have a faster access time than the boot block. Access to the boot block is not required after the boot process has completed. 4. ...
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Write Cycle Timing Standard Interface A[12:0], BHE CE# OE# WE# D[15:0] Figure 21: Standard Interface Write Cycle Timing Table 16: Standard Interface Write Cycle Parameters (VCC=2.5-3.6V) Symbol T (A) Address to WE# SU Tho(A) WE# to Address ...
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Table 17: Standard Interface Write Cycle Parameters (VCC=2.7V-3.6V) Symbol T (A) Address to WE# SU Tho(A) WE# to Address hold time Tw(WE) WE# asserted width T Write Cycle Time WCYC Tsu (CE0) CE# to WE# Tho (CE0) WE# to CE# ...
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Read Cycle Timing Multiplexed Interface AVD# T (AVD) SU AD[15:0] CE# T (CE1) HO OE# WE# Figure 22: Multiplexed Interface Read Cycle Timing Table 18: Multiplexed Interface Read Cycle Parameters (VCC 2.5-3.6V) Symbol Description tsu(AVD) Address to AVD# tho(AVD) ...
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Table 19: Multiplexed Interface Read Cycle Parameters (VCC=2.7V-3.6V) Symbol Description tsu(AVD) Address to AVD# tho(AVD) Address to AVD# Tw(AVD) AVD# low pulse width 1 tsu(CE0) CE# to OE# 2 tho(CE0) OE# to CE# tho(CE1) OE# or WE# tsu(CE1) CE# to ...
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Write Cycle Timing Multiplexed Interface AVD# T AD[15: CE# OE# WE# Figure 23: Multiplexed Interface Write Cycle Timing Table 20: Multiplexed Interface Write Cycle Parameters (VCC=2.5V-3.6V) Symbol tsu(AVD) Address to AVD# tho(AVD) Address to AVD# Tw(AVD) AVD# ...
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Table 21: Multiplexed Interface Write Cycle Parameters (VCC=2.7-3.6V) Symbol tsu(AVD) Address to AVD# tho(AVD) Address to AVD# Tw(AVD) AVD# low pulse width 1 tsu(AVD-WE) AVD# to WE# Trec(WE-AVD) WE# to AVD# WE# asserted width (RAM) tw(WE) WE# asserted width (all ...
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Power-Up Timing Mobile DiskOnChip Plus is reset by assertion of the RSTIN# input. When this signal is negated, DiskOnChip initiates a download procedure from the flash memory into the internal Programmable Boot Block. During this procedure, Mobile DiskOnChip Plus ...
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Symbol 1 T (VCC-RSTIN) REC 1 Tp (VCC-BUSY0) T (RSTIN (BUSY0 (BUSY1 (BUSY-CE (D-BUSY1 Tho(RSTIN-AVD) 1. Specified from the final positive crossing of Vcc above 2.5V and ...
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Mechanical Dimensions See Figure 26 for the mechanical dimensions of the FBGA package. FBGA Dimensions (16MB): 9.0±0. 12.0±0. 1.2±0.1 mm FBGA Dimensions (32MB): 9.0±0. 12.0±0. 1.4±0.1 mm Ball Pitch: 0.8mm 9.0 ...
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... Regular P Lead-free Temperature Type 1 Range Commercial Regular Extended Regular Commercial Lead-free Extended Lead-free Commercial Regular Extended Regular Commercial Lead-free Extended Lead-free N/A Daisy-Chain Data Sheet, Rev. 1.7 Mobile DiskOnChip Plus 16/32MByte 1.8V I/O Order Information MD3831-D16-V3Q18 MD3831-D16-V3Q18-X MD3831-D16-V3Q18-P MD3831-D16-V3Q18-X-P MD3331-D32-V3Q18 MD3331-D32-V3Q18-X MD3331-D32-V3Q18-P MD3331-D32-V3Q18-X-P MD3831-D00-DAISY 95-SR-000-10-8L ...
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... How to Contact Us Internet: General Information: Sales and Technical Information: USA M-Systems Inc. 8371 Central Ave, Suite A Newark CA 94560 Phone: +1-510-494-2090 Fax: +1-510-494-5545 Taiwan M-Systems Asia Ltd. Room No. 133 Sec. 3 Min Sheng East Road Taipei, Taiwan R.O.C. Tel: +886-2-8770-6226 Fax: +886-2-8770-6295 Japan Asahi Seimei Gotanda Bldg ...