TSS463VAN Temic Semiconductors (acquired by ATMEL Corporation), TSS463VAN Datasheet - Page 12

• Manufacturer Part Number: TSS463VAN
• Description: Van Controller Serial Interface
• Manufacturer: Temic Semiconductors (acquired by ATMEL Corporation)

Qualpack TS80C31X2/C32X2
4.2 Qualification Flow
General Requirements for Plastic packaged CMOS IC
12
MIL-STD 883D
Method 3015.7
MIL-STD 883D
MIL-STD 883D
MIL-STD 883D
MIL-STD 883D
MIL-STD 883D
JESD22-A101
JESD22-A110
JESD22-A112
Method 1005
Method 1005
Method 1010
Method 2003
Method 2015
PAQA0046
PAQA0184
JEDEC 17
Standard
MHS
MHS
EIA
EIA
EIA
1000 hours 150°C 5.75V Dynamic or Static
Electrical Life Test (Latent Failure Rate)
Electrical Life Test (Early Failure Rate)
Pressure Pot after Mounting Stress
Infra Red Stress 220°C/25s/3 times
+/-2000v 1.5kOhm/100pF/3 pulses
High Temperature Storage 165°C
1000 cycles -65°C/150°C air/air
Resistance to Soldering Heat
Electrostatic Discharge HBM
336 hours 130°C/85%RH/5.5V
50mW power injection 125°C
12 hours 150°C (Tj) 5.75V
168 hours 130°C/85%RH
1000 hours 85°C/85%RH
Marking Permanency
Temperature Cycling
PROM Dataretention
85/85 Humidity Test
Test Description
Solderability
Latch up
HAST
Qualification type
Die and Package
(0/10 per class)
(0/3 per level)
(acceptance)
(1/2000 12h)
(0/116 500h)
(0/45 500h)
(0/45 500c)
(0/45 168h)
(0/45 500h)
(0/45 168h)
Device and
Device and
Device and
Package
Package
Package
Package
Package
Package
Device
Device
Device
Device
Device
(0/10)
(0/3)
(0/3)
Rev. 2 – January 1999