TSS463VAN Temic Semiconductors (acquired by ATMEL Corporation), TSS463VAN Datasheet - Page 20

• Manufacturer Part Number: TSS463VAN
• Description: Van Controller Serial Interface
• Manufacturer: Temic Semiconductors (acquired by ATMEL Corporation)

Qualpack TS80C31X2/C32X2
5. User Information
5.1 Soldering Recommendations
For DRY PACKED products,
hereunder:
5.2 DRY PACK Ordering rules
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determine the convenient conditioning for safe customer use.
Nevertheless, even if the product is not classified as moisture sensitive, it is possible (for example if
storage conditions are not properly controlled) to order product with a Dry Pack.
In this case the product name suffix will be ":D" or ":xD".
5.3 ESD caution
The user must protect components against EOS and ESD damages by grounding personal and
workstations.
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EMIC qualification procedure allows to classify products according to JEDEC 22-A112 and to
- Dry packed products must not be stored more than 1 year at 40°c - 90%rh
- A longer storage period is allowed taking into account the following conditions:
- From opening of the packs, the product must be assembled within 48 hours.
- If they cannot be soldered within this time period, then the pieces must be dryed at
- Max relative humidity allowed in the bag is 20% (readable on the indicator inside
- For high sensitive products, the delay between pack opening and assembly is
(worst storage conditions assumed)
5 years max at 25°c (+/-5°c) - 50%rh
(worst in-process storage condition assumed: 30°c - 60%rh)
125°c for 24 hours. Only one drying is allowed.
the bag). If this value is reached, then the parts must be dryed at 125°C for
24 hours before mounting.
reduced to 6 hours (Level 6 of JEDEC 22-A112). In this case, a warning printed on
each pack advises the user of this restriction .
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EMIC recommends to strictly follow the procedure described
Rev. 2 – January 1999