TSS463VAN Temic Semiconductors (acquired by ATMEL Corporation), TSS463VAN Datasheet - Page 17

• Manufacturer Part Number: TSS463VAN
• Description: Van Controller Serial Interface
• Manufacturer: Temic Semiconductors (acquired by ATMEL Corporation)

4.5.1 ESD and Latch-up results
4.5.2 Failure Mechanisms and Corrective Actions
Failure Mechanism
Poly silicide
defects
Die top
delamination
4.5.3 Qualification status
The Wafer Process and the assembly are qualified and controlled by regular monitoring.
The TSS461C VAN is full qualified since 1996 July.
The TSS463 VAN is full qualified since 1997 October.
Additional measurements done in 1998 and generic results demonstrate compliance of the two products
to Q100 Automotive Standard.
Rev. 2 – January 1999
Lot
Number
Z21538B
Z19814
Device Type Test Description
TSS463
SO 16
TSS461C
DIL 24.3
TSS461C
Root Cause
Process
conditions
Sumitomo630
0 molding
compound
ESD HBM model
ESD CDM model
Latch up Vcc
overstress
LU power injection
ESD HBM model
ESD CDM model
Latch up Vcc
overstress
LU power injection
Corrective Action
Reduce silicide
temperature,
increase duration
Move to Nitto
MP8000
Step Resul
3000v
4000v
4500v
5000v
1500v
50mW
3000v
4000v
1500v
50mW
10v
10v
Date
Nov 97
Jan 98
t
0/10
1/13
3/13
0/10
0/10
0/10
0/10
0/10
0/4
0/5
3/3
0/4
Qualpack TSS463 / TSS461C
Effect
Robusteness
improved
No more
moitures
sensitivity
Comment
CLASS 2
Leackage pin 6
Leackages pin 2,6,15
CLASS C6 (EOS/ESD of
association)
CLASS 2
Leakages
CLASS C6
Check of
Efficiency
EFR monitoring
pass level 1 of
JESD 22 A112
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