TSS463VAN Temic Semiconductors (acquired by ATMEL Corporation), TSS463VAN Datasheet - Page 14

• Manufacturer Part Number: TSS463VAN
• Description: Van Controller Serial Interface
• Manufacturer: Temic Semiconductors (acquired by ATMEL Corporation)

Qualpack TS80C31X2/C32X2
4.4 Package Qualification
This section presents TSS463 and TSS461C package qualification results, including additional
measurements intending to fulfil Q100 Automotive Standard requirements.
14
Lot
Number
Z21538F
Z21997A
W28184C
Z04948C
Device Type
TSS463
in SO 16 (1)
TSS463
in SO 16 (2)
29C461B
in SO 24 (1)
TSS461C
Test Description
Thermal Cycles
85/85 Humidity
Resistance to Soldeting
Heat
HAST after Soldering
Stress (with 5.5v bias)
Thermal Cycles
85/85 Humidity
HAST after Soldering
Stress
165c HT Storage
Physical Dimensions
Bonding Destructive Tests
(4)
Resistance to Soldeting
Heat
Thermal Cycles
85/85 Humidity
HAST after Soldering
Stress
Thermal Cycles
85/85 Humidity
HAST after Soldering
Stress
HAST 5.5V
Step
Level 1
Level 3
Level 1
Level 2
Level 5
1000h
2000h
1000h
1000h
1000h
1000h
1000c
2000c
1000c
Visual
1000c
1000c
168h
500h
168h
500h
500h
168h
500h
168h
168h
336h
500c
SAM
500c
500c
WP
BS
Result
0/45 (3)
0/45 (3)
0/45 (3)
0/30 (5)
0/45
0/45
0/45
0/45
1/10
0/10
0/45
0/45
0/45
0/10
0/45
0/45
0/30
0/10
0/10
0/10
0/45
0/45
0/45
0/45
0/45
0/45
0/45
0/45
0/45
0/45
0/45
0/45
0/5
Comment
1 die top delamination
AVG=77.3 STD=8.9 CPK=1.8
MAX=98.9 MIN=61.1
AVG=17.4 STD=1.5 CPK=2.3
MAX=21.1 MIN=14.3
Rev. 2 – January 1999