MT28C3224P20 Micron Technology, MT28C3224P20 Datasheet - Page 41

• Manufacturer Part Number: MT28C3224P20
• Description: FLASH AND SRAM COMBO MEMORY
• Manufacturer: Micron Technology

NOTE: 1. All dimensions in millimeters.
DATA SHEET DESIGNATION
Advance: This data sheet contains initial descriptions of products still under development.
2 Meg x 16 Page Flash 256K x 16 SRAM Combo Memory
MT28C3224P20_3.p65 – Rev. 3, Pub. 7/02
SEATING PLANE
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
0.10
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.27mm per side.
66X Ø 0.35
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
C
5.60
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
2.80 ±0.05
1.05 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
4.40 ±0.05
BALL A12
12.00 ±0.10
8.80
C L
(TYP)
0.80
6.00 ±0.05
66-BALL FBGA
C L
BALL A1
BALL #1 ID
4.00 ±0.05
41
256K x 16 SRAM COMBO MEMORY
(TYP)
0.80
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.40 MAX
2 MEG x 16 PAGE FLASH
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL A1
©2002, Micron Technology, Inc.
ADVANCE