IDT72255LA10PF IDT, Integrated Device Technology Inc, IDT72255LA10PF Datasheet - Page 17

IC FIFO SUPERSYNC 8KX18 64QFP

IDT72255LA10PF

Manufacturer Part Number
IDT72255LA10PF
Description
IC FIFO SUPERSYNC 8KX18 64QFP
Manufacturer
IDT, Integrated Device Technology Inc
Series
7200r
Datasheet

Specifications of IDT72255LA10PF

Function
Synchronous
Memory Size
144K (8K x 18)
Access Time
10ns
Voltage - Supply
4 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
64-TQFP, 64-VQFP
Configuration
Dual
Density
144Kb
Access Time (max)
8ns
Word Size
18b
Organization
8Kx18
Sync/async
Synchronous
Expandable
Yes
Bus Direction
Uni-Directional
Package Type
TQFP
Clock Freq (max)
100MHz
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4V
Operating Supply Voltage (max)
5.5V
Supply Current
80mA
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Data Rate
-
Lead Free Status / Rohs Status
Not Compliant
Other names
72255LA10PF
800-1499

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT72255LA10PF
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72255LA10PF8
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72255LA10PFG
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72255LA10PFG8
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Q
NOTES:
1. t
2. LD = HIGH, OE = LOW, EF = HIGH
D
Q
NOTES:
1. t
2. LD = HIGH.
3. First word latency: 60ns + t
IDT72255LA/72265LA CMOS SuperSync FIFO™
8,192 x 18 and 16,384 x 18
D
WCLK
RCLK
WCLK
0
0
0
0
RCLK
rising edge of the RCLK and the rising edge of the WCLK is less than t
WEN
rising edge of WCLK and the rising edge of RCLK is less than t
SKEW1
- Q
- D
REN
SKEW3
- D
- Q
FF
n
n
n
n
is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go high (after one WCLK cycle pus t
is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus t
t
ENS
t
DATA IN OUTPUT REGISTER
ENS
t
t
OLZ
SKEW1
t
ENH
t
REF
t
REF
A
Figure 8. Read Cycle, Empty Flag and First Data Word Latency Timing (IDT Standard Mode)
t
OE
(1)
+ 1*
TRCLK
t
t
SKEW3
ENH
t
ENS
t
DS
t
A
.
D
(1)
1
0
NO WRITE
Figure 7. Write Cycle and Full Flag Timing (IDT Standard Mode)
NO OPERATION
t
t
DHS
ENH
LAST WORD
1
SKEW3
2
t
WFF
, then EF deassertion may be delayed one extra RCLK cycle.
SKEW1
t
t
DS
OHZ
t
t
DS
t
ENS
CLKH
, then the FF deassertion may be delayed one extra WCLK cycle.
D
D
1
X
NO OPERATION
t
WFF
t
t
17
ENH
DATA READ
DH
t
t
DH
CLK
2
t
CLKL
t
CLKH
t
t
REF
ENS
t
OLZ
t
SKEW1
t
CLK
(1)
t
CLKL
t
ENS
t
ENH
LAST WORD
t
A
1
NO WRITE
t
ENH
t
A
COMMERCIAL AND INDUSTRIAL
WFF
2
REF
TEMPERATURE RANGES
). If the time between the
). If the time between the
NEXT DATA READ
t
t
ENS
WFF
JANUARY 13, 2009
t
DS
D
0
D
X
+1
t
REF
t
t
4670 drw10
ENH
A
t
DH
t
WFF
4670 drw 11
D
1

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