IDT72V82L20PA IDT, Integrated Device Technology Inc, IDT72V82L20PA Datasheet - Page 7

IC FIFO ASYNCH 1KX9 56TSSOP

IDT72V82L20PA

Manufacturer Part Number
IDT72V82L20PA
Description
IC FIFO ASYNCH 1KX9 56TSSOP
Manufacturer
IDT, Integrated Device Technology Inc
Series
72Vr
Datasheet

Specifications of IDT72V82L20PA

Function
Asynchronous
Memory Size
9K (1K x 9)
Data Rate
33MHz
Access Time
20ns
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
56-TSSOP
Configuration
Dual
Density
18Kb
Access Time (max)
20ns
Word Size
9b
Organization
1Kx9x2
Sync/async
Asynchronous
Expandable
Yes
Bus Direction
Bi-Directional
Package Type
TSSOP
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Supply Current
100mA
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
56
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
72V82L20PA

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT72V82L20PA
Manufacturer:
IDT
Quantity:
20 000
OPERATING MODES:
system (i.e. FF is monitored on the device where W is used; EF is monitored on
the device where R is used).
Single Device Mode
application requirements are for 512/1,024/2,048/4,096/8,192 words or less.
These FIFOs are in a Single Device Configuration when the Expansion In (XI)
control input is grounded (see Figure 12).
Depth Expansion
are for greater than 512/1,024/2,048/4,096/8,192 words. Figure 14 demon-
HF
XO
IDT72V81/72V82/72V83/72V84/72V85 3.3V CMOS DUAL ASYNCHRONOUS FIFO
512 x 9, 1024 x 9, 2048 x 9, 4096 x 9, 8192 x 9
R
W
XI
W
W
R
R
Care must be taken to assure that the appropriate flag is monitored by each
A single IDT72V81/72V82/72V83/72V84/72V85 may be used when the
These devices can easily be adapted to applications when the requirements
t
XIS
HALF-FULL OR LESS
LAST PHYSICAL
LOCATION
WRITE TO
t
XOL
t
XI
FIRST PHYSICAL
LOCATION
WRITE TO
t
WHF
t
XOH
t
XIR
Figure 9. Half-Full Flag Timing
Figure 10. Expansion Out
Figure 11. Expansion In
MORE THAN HALF-FULL
7
strates a four-FIFO Depth Expansion using two IDT72V81/72V82/72V83/
72V84/72V85s. Any depth can be attained by adding additional IDT72V81/
72V82/72V83/72V84/72V85s. These FIFOs operate in the Depth Expansion
mode when the following conditions are met:
1. The first FIFO must be designated by grounding the First Load (FL) control
2. All other FIFOs must have FL in the high state.
3. The Expansion Out (XO) pin of each device must be tied to the Expansion
4. External logic is needed to generate a composite Full Flag (FF) and Empty
5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in
t
input.
In (XI) pin of the next device. See Figure 14.
Flag (EF). This requires the ORing of all EFs and ORing of all FFs (i.e. all
must be set to generate the correct composite FF or EF). See Figure 14.
the Depth Expansion Mode.
XIS
LAST PHYSICAL
READ FROM
LOCATION
t
XOL
FIRST PHYSICAL
READ FROM
LOCATION
t
RHF
COMMERCIAL TEMPERATURE RANGE
t
XOH
HALF-FULL OR LESS
FEBRUARY 5, 2009
3966 drw 11
3966 drw 12
3966 drw 13

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