MT28F128J3FS-11ET Micron, MT28F128J3FS-11ET Datasheet - Page 51

• Manufacturer Part Number: MT28F128J3FS-11ET
• Description: 32Mb Q-flash memory
• Manufacturer: Micron

NOTE: 1. All dimensions in millimeters.
DATA SHEET DESIGNATIONS
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full
No Marking: This data sheet contains minimum and maximum limits specified over the complete power supply
128Mb, 64Mb, 32Mb Q-Flash Memory
MT28F640J3_7.p65 – Rev. 6, Pub. 8/02
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.40
SEATING PLANE
64X ∅0.45
7.00 ±0.05
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
0.08 C
Micron, the Micron and M logos and Q-Flash are trademarks and/or servicemarks of Micron Technology, Inc.
3.50 ±0.05
BALL A8
characterization of production devices. This designation applies to the MT28F320J3 and MT28F128J3
devices.
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur. This
designation applies to the MT28F640J3 device.
0.850 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.50 ±0.05
1.00 TYP
10.00 ±0.10
7.00
C L
5.50 ±0.05
64-BALL FBGA
1.00 TYP
C L
6.50 ±0.05
BALL A1
BALL A1 ID
51
13.00 ±0.10
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .33mm
128Mb, 64Mb, 32Mb
Q-FLASH MEMORY
BALL A1 ID
©2002, Micron Technology, Inc.