MT29F16G08FAAWC Micron, MT29F16G08FAAWC Datasheet - Page 80
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MT29F16G08FAAWC
Manufacturer Part Number
MT29F16G08FAAWC
Description
NAND Flash Memory; Density: 16Gb; Organization: 2Gbx8; Bits/Cell: SLC; I/O: Common; Supply Voltage: 3.3V; Operating Temperature Range: 0° to +70°C; Package: 48-TSOP
Manufacturer
Micron
Datasheet
1.MT29F16G08FAAWC.pdf
(81 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT29F16G08FAAWC:A
Manufacturer:
MICRON
Quantity:
11 418
Part Number:
MT29F16G08FAAWC:A
Manufacturer:
MICRON
Quantity:
20 000
Figure 77:
PDF: 09005aef81b80e13/Source: 09005aef81b80eac
4gb_nand_m40a__2.fm - Rev. B 2/07 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
12.00 ±0.08
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product
24
1
0.15
+0.03
-0.02
48-Pin TSOP OCPL Type 1 (WC Package Code)
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Note:
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
All dimensions are in millimeters.
development and data characterization sometimes occur.
20.00 ±0.25
18.40 ±0.08
their respective owners.
See detail A
80
4Gb, 8Gb, and 16Gb x8 NAND Flash Memory
®
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
48
25
0.10
0.25 for
reference only
0.50 for
reference only
+0.10
-0.05
0.10
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
Detail A
Mold compound:
Plated lead finish:
Package width and length do
not include mold protrusion.
Allowable protrusion is
0.25 per side.
Epoxy novolac
100% Sn
0.27 MAX
0.17 MIN
0.80
0.50 ±0.1
0.25
Gage
plane