sc3200 Advanced Micro Devices, sc3200 Datasheet - Page 443

• Manufacturer Part Number: sc3200
• Description: Geode-tm Sc3200 Processor
• Manufacturer: Advanced Micro Devices

Appendix A: Support Documentation
A.1
1.
2.
A.2
This document is a report of the revision/creation process of the data book for the Geode SC3200. Any revisions (i.e., addi-
tions, deletions, parameter corrections, etc.) are recorded in the table below.
AMD Geode™ SC3200 Processor Data Book
Order Number (AMD OPN)
SC3200UCL-266
SC3200UCL-266F
SC3200UFH-233
SC3200UFH-233F
SC3200UFH-266
SC3200UFH-266F
(February 2001)
(October 1999)
(January 2000)
(August 1999)
(August 2000)
(March 2000)
The “F” suffix denotes the lead free package.
As of this publication date, a lead free package version may not be available. Check with your local AMD Sales Repre-
sentative for availability. See Section 10.0 "Package Specifications" on page 439 for details on the lead free part.
(April 2002)
(PDF Date)
Revision #
(July 2000)
1.32
0.1
0.2
0.5
0.8
1.0
1.1
2.0
Order Information
Data Book Revision History
Revisions / Comments
First draft of data book. (For internal review only)
Second draft.
Draft.
Draft
Preliminary data book.
Corrected typos, removed umimplemented features.
tions. Video Input Port (VIP) added.
TEPBGA ball assignments have been added. Additionally, internal test signals and multiplexing
have been included. This data book should be viewed as a new document.
Preliminary data book. GNT[1:0]# strapping functions changed. Minor modifications and correc-
The entire data book has been reformatted and several sections re-written. Strap information and
Appendix
1
Frequency
(MHz)
Core
266
233
266
Table A-1. Revision History
ASupport Documentation
(V
Voltage
Core
1.8V
1.8V
1.8V
CORE
)
(Degree C)
Temp.
0 - 85
0 - 85
0 - 85
Revision 5.1
Package
EBGA
Lead Free EBGA
TEPBGA
Lead Free TEPBGA
TEPBGA
Lead Free TEPBGA
2
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