74AHCT377PW,112 NXP Semiconductors, 74AHCT377PW,112 Datasheet
74AHCT377PW,112
Specifications of 74AHCT377PW,112
935267993112
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74AHCT377PW,112 Summary of contents
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Octal D-type flip-flop with data enable; positive-edge trigger Rev. 02 — 12 June 2008 1. General description The 74AHC377; 74AHCT377 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL specified ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74AHC377 74AHC377D +125 C 74AHC377PW +125 C 74AHCT377 74AHCT377D +125 C 74AHCT377PW +125 C 4. Functional diagram Fig 1. Functional diagram 74AHC_AHCT377_2 Product data sheet 74AHC377; 74AHCT377 Octal D-type flip-flop with data enable; positive-edge trigger ...
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... NXP Semiconductors Fig 2. Logic symbol FF1 CP Q0 Fig 4. Logic diagram 74AHC_AHCT377_2 Product data sheet 74AHC377; 74AHCT377 Octal D-type flip-flop with data enable; positive-edge trigger mna918 Fig FF2 FF3 FF4 Rev. 02 — 12 June 2008 11 1C2 mna919 IEC logic symbol FF5 FF6 ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 5. Pin configuration SO20 and TSSOP20 5.2 Pin description Table 2. Pin description Symbol Pin GND 74AHC_AHCT377_2 Product data sheet 74AHC377; 74AHCT377 Octal D-type flip-flop with data enable; positive-edge trigger 377 GND mna917 Description data enable input (active LOW) fl ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Operating mode Load 1 Load 0 Hold (do nothing) [ HIGH voltage level HIGH voltage level one set-up time prior to the LOW-to-HIGH CP transition LOW voltage level LOW voltage level one set-up time prior to the LOW-to-HIGH CP transition; = LOW-to-HIGH CP transition; ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Operating conditions Symbol Parameter 74AHC377 V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 74AHCT377 V supply voltage CC V input voltage I V output voltage O T ambient temperature ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I input leakage GND current 5 supply current 5 input capacitance 74AHCT377 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage 8 LOW-level output voltage ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions 74AHC377 t propagation CP to Qn; see pd delay maximum see Figure 6 max frequency pulse width CP HIGH or LOW; W see Figure 3 3.6 V ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions 74AHCT377 4 5 propagation CP to Qn; see pd delay maximum see Figure 6 max frequency pulse width CP HIGH or LOW; W see Figure 6 t set-up time Dn CP; see su t hold time Dn ...
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... NXP Semiconductors 11. Waveforms CP input Qn output Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 6. Clock pulse width, maximum frequency and input to output propagation delays E input Dn input CP input Measurement points are given in The shaded areas indicate when the input is permitted to change for predictable output performance. ...
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... NXP Semiconductors Test data is given in Table Definitions test circuit termination resistance should be equal to output impedance load capacitance including jig and probe capacitance. L Fig 8. Load circuitry for measuring switching times Table 9. Test data Type Input V I 74AHC377 V CC 74AHCT377 3.0 V 74AHC_AHCT377_2 Product data sheet Octal D-type fl ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Document ID Release date 74AHC_AHCT377_2 20080612 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 74AHC_AHCT377_1 20000815 74AHC_AHCT377_2 Product data sheet 74AHC377 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 Revision history ...