irf6722m International Rectifier Corp., irf6722m Datasheet - Page 3
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irf6722m
Manufacturer Part Number
irf6722m
Description
Direct Fetpower Mosfet
Manufacturer
International Rectifier Corp.
Datasheet
1.IRF6722M.pdf
(9 pages)
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Used double sided cooling , mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
(still air).
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fl
f
jl
kl
l
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
small clip heatsink (still air)
0.01
R
τ
θ
J
τ
is measured at
J
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
0.1
R
1
R
1
with
τ
2
R
τ
2
2
R
2
T
1
J
Typ.
12.5
–––
–––
of approximately 90°C.
1.0
20
R
τ
3
3
R
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
τ
3
3
τ
-40 to + 150
A
τ
A
Ri (°C/W)
Max.
0.018
footprint full size board with
metalized back and with small
clip heatsink (still air)
10
270
Mounted on minimum
2.3
1.5
IRF6722MPbF
42
6.3466
26.688
21.955
Max.
–––
–––
–––
3.0
55
0.00237
0.9124
43.9
100
τi (sec)
1000
Units
Units
°C/W
W/°C
°C
W
3