s29ns01gr Meet Spansion Inc., s29ns01gr Datasheet - Page 12

• Manufacturer Part Number: s29ns01gr
• Description: S29ns01gr 1gb 64 M X 16 Bit , 1.8 V Burst Simultaneous Read/write, Multiplexed Mirrorbit Flash Memory
• Manufacturer: Meet Spansion Inc.

12
4.2.3
VDH064—64-Ball Very Thin Fine-Pitch Ball Grid Array
PACKAGE
JEDEC
SYMBOL
SD / SE
Ø b
MD
ME
A1
A2
D1
E1
D
N
A
E
e
0.84
0.18
0.64
0.25
MIN
8.00 mm x 9.20 mm NOM
PACKAGE
8.00 BSC.
9.20 BSC.
4.50 BSC.
2.50 BSC.
0.50 BSC.
0.25 BSC.
VDH 064
Figure 4.3 VDH064—64-Ball Very Thin Fine-Pitch Ball Grid Array
NOM
0.30
N/A
---
---
---
10
64
6
D a t a
MAX
1.00
0.78
0.35
---
S29NS-R MirrorBit
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
NOTE
( A d v a n c e
®
Flash Family
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
EXCEPT AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
I n f o r m a t i o n )
S29NS-R_00_03 May 9, 2008
3636 \ 16-038.27 \ 5.22.7