s29jl064j Meet Spansion Inc., s29jl064j Datasheet - Page 58

• Manufacturer Part Number: s29jl064j
• Description: 64 Megabit 8m X 8-bit/4m X 16-bit Cmos 3.0 Volt-only, Simultaneous Read/write Flash Memory
• Manufacturer: Meet Spansion Inc.

20.2
58
VBK048—48-Pin FBGA
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
D1
E1
φb
A
D
N
E
e
MIN
0.18
0.33
---
8.15 mm x 6.15 mm NOM
PACKAGE
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
VBK 048
NOM
N/A
48
---
---
---
---
8
6
MAX
1.00
0.43
---
OVERALL THICKNESS
BALL HEIGHT
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29JL064J
D a t a
NOTE
S h e e t
NOTES:
10
1.
2.
3.
4.
5.
6
7
8.
9.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
NOT USED.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S29JL064J_00_03 April 7, 2011
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