cy7c1380d-250bzxi Cypress Semiconductor Corporation., cy7c1380d-250bzxi Datasheet - Page 30

• Manufacturer Part Number: cy7c1380d-250bzxi
• Description: 18-mbit 512k X 36/1m X 18 Pipelined Sram
• Manufacturer: Cypress Semiconductor Corporation.

Document History Page
Document #: 38-05543 Rev. *E
Document Title: CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F, 18-Mbit (512K x 36/1M x 18) Pipelined SRAM
Document Number: 38-05543
REV.
*A
*B
*C
*D
*E
**
ECN NO. Issue Date
254515
288531
326078
416321
475009
776456
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
Change
Orig. of
NXR
RKF
SYT
VKN
VKN
PCI
New data sheet
Edited description under “IEEE 1149.1 Serial Boundary Scan (JTAG)” for
non-compliance with 1149.1
Removed 225MHz and 133 MHz Speed Bins
Added Pb-free information for 100-Pin TQFP, 119 BGA and 165 FBGA Packages
Added comment of ‘Pb-free BG packages availability’ below the Ordering Infor-
mation
Address expansion pins/balls in the pinouts for all packages are modified as per
JEDEC standard
Added description on EXTEST Output Bus Tri-State
Changed description on the Tap Instruction Set Overview and Extest
Changed Device Width (23:18) for 119-BGA from 000000 to 101000
Added separate row for 165 -FBGA Device Width (23:18)
Changed Θ
°C/W respectively
Changed Θ
respectively
Changed Θ
respectively
Modified V
Removed comment of ‘Pb-free BG packages availability’ below the Ordering Infor-
mation
Updated Ordering Information Table
Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901
North First Street” to “198 Champion Court”
Changed the description of I
on page# 18
Changed the I
to –30 µA and 5 µA
Changed the I
to –5 µA and 30 µA
Changed V
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated Ordering Information Table
Added the Maximum Rating for Supply Voltage on V
Changed t
Switching Characteristics table.
Updated the Ordering Information table.
Added Part numbers CY7C1380F and CY7C1382F and its related information
Added footnote# 3 regarding Chip Enable
Updated Ordering Information table
TH
OL,
JA
JA
IH
JA
, t
and Θ
< V
and Θ
and Θ
V
X
X
TL
OH
current values of MODE on page # 18 from –5 µA and 30 µA
current values of ZZ on page # 18 from –30 µA and 5 µA
DD
from 25 ns to 20 ns and t
test conditions
JC
JC
JC
to V
for FBGA Package from 46 and 3 °C/W to 20.7 and 4.0 °C/W
for BGA Package from 45 and 7 °C/W to 23.8 and 6.2 °C/W
for TQFP Package from 31 and 6 °C/W to 28.66 and 4.08
IH
< V
X
Description of Change
from Input Load Current to Input Leakage Current
DD
on page # 18
CY7C1380D, CY7C1380F
CY7C1382D, CY7C1382F
TDOV
from 5 ns to 10 ns in TAP AC
DDQ
Relative to GND
Page 30 of 30
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