pcf2113du/f4 NXP Semiconductors, pcf2113du/f4 Datasheet - Page 63
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pcf2113du/f4
Manufacturer Part Number
pcf2113du/f4
Description
Pcf2113x Lcd Controllers/drivers
Manufacturer
NXP Semiconductors
Datasheet
1.PCF2113DUF4.pdf
(72 pages)
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Philips Semiconductors
18 TRAY INFORMATION
2001 Dec 19
handbook, full pagewidth
handbook, halfpage
LCD controllers/drivers
For dimensions see Table 19.
The orientation of the IC in a pocket is indicated by the position of the
IC type name on the die surface with respect to the chamfer on the
upper left corner of the tray. Refer to the bonding pad location
diagram for the orientating and position of the type name on the die
surface.
Fig.36 Tray alignment.
PC2113x
y
F
x
MGU207
Fig.35 Tray details.
A
63
E
Table 19 Tray dimensions
Table 20 Bump size
Type
Bump width
Bump length
Bump height
Height difference in one die <2
Convex deformation
Pad size, aluminium
Passivation opening CBB
Wafer thickness
DIMENSION
C
D
A
B
E
F
x
y
PARAMETER
C
MGU206
pocket pitch x direction
pocket pitch y direction
pocket width x direction
pocket width y direction
tray width x direction
tray width y direction
pockets in x direction
pockets in y direction
DESCRIPTION
D
B
galvanic pure Au
50 6
90 6
17.5 5
<5
62
36
380 25
100
76
VALUE
Product specification
PCF2113x
6.35 mm
5.59 mm
3.82 mm
3.66 mm
50.8 mm
50.8 mm
VALUE
7
8
UNIT
m
m
m
m
m
m
m
m
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