pcf8534ah-1 NXP Semiconductors, pcf8534ah-1 Datasheet - Page 32
pcf8534ah-1
Manufacturer Part Number
pcf8534ah-1
Description
Universal Lcd Driver For Low Multiplex Rates
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8534AH-1.pdf
(36 pages)
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The position of the bonding pads is not to scale.
Chip dimensions: approximately 5.40
Bump dimensions: 90
Wafer thickness: 381 m.
50
C 2
F
17.5 m.
1.51 mm.
PC8533-2
Fig.22 Bonding pad locations.
0, 0
y
x
C 1
MGL759
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