uda1321 NXP Semiconductors, uda1321 Datasheet - Page 43

• Manufacturer Part Number: uda1321
• Description: Universal Serial Bus Usb Digital-to-analog Converter Dac
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Method (QFP and SO)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 C within
6 seconds. Typical dwell time is 4 seconds at 250 C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
1998 Oct 06
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Universal Serial Bus (USB)
Digital-to-Analog Converter (DAC)
Purchase of Philips I
components in the I
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
2
C system provided the system conforms to the I
2
C components conveys a license under the Philips’ I
43
R
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 C.
EPAIRING SOLDERED JOINTS
2
C specification defined by
Preliminary specification
2
C patent to use the
UDA1321