pdiusbh12 NXP Semiconductors, pdiusbh12 Datasheet - Page 27

• Manufacturer Part Number: pdiusbh12
• Description: Usb 2-port Hub
• Manufacturer: NXP Semiconductors

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version)
4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must
5. Wave soldering is only suitable for LQFP, QFP, and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pith (e) equal to or larger than 0.65 mm; it is definitely not suitable for
Philips Semiconductors
SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS
NOTES:
1999 Jul 22
Through-hole mount
Surface mount
USB 2-port hub
time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in
them (the so-called “popcorn” effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages;
Section: Packing Methods”.
cannot be achieved, and as solder may stick to the heatsink (on top version).
incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
packages with a pitch (e) equal to or smaller than 0.5 mm.
Mo nting
Mounting
DBS, DIP, HDIP, SDIP, SIL
BGA, SQFP,
HLQFP, HSQFP, HSOP, SMS
PLCC, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Package
Package
not recommended
not recommended
not suitable
not suitable
suitable
27
suitable
Wave
2
3
4, 5
6
Soldering Method
Reflow
suitable
suitable
suitable
suitable
suitable
–
1
PDIUSBH12
Product specification
Dipping
suitable
–
–
–
–
–