tea1114auh NXP Semiconductors, tea1114auh Datasheet - Page 21

• Manufacturer Part Number: tea1114auh
• Description: Low Voltage Telephone Transmission Circuit With Dialler Interface And Regulated Strong Supply
• Manufacturer: NXP Semiconductors

Philips Semiconductors
BONDING PAD LOCATIONS FOR TEA1114AUH
All x/y coordinates represent the position of the centre of the pad (in m) with respect to the origin (x/y = 0/0) of the die
(see Fig.18). The size of all pads is 80 m
2000 Mar 21
handbook, full pagewidth
LN
SLPE
REG
IR
AGC
DTMF
V
MUTE
QR
n.c.
V
n.c.
GAR
RX
MIC+
MIC
V
n.c.
LN
DD
EE
CC
Low voltage telephone transmission circuit with
dialler interface and regulated strong supply
SYMBOL
V CC
x
n.c.
LN
LN
0,0
y
SLPE
17
18
19
MICM
1
2
16
Fig.18 TEA1114AUH bonding pad locations.
PAD
MICP
10
11
12
13
14
15
16
17
18
19
REG
15
1
2
3
4
5
6
7
8
9
80 m.
3
IR
4
21
RX
14
AGC
5
GAR
13
1219.5
782.5
357.5
141.5
1162
1343
1366
1366
1366
1370
1045
126
377
639
869
99
99
99
99
DTMF
x
6
n.c.
12
COORDINATES
V DD
V EE
7
10
11
8
9
n.c.
QR
MUTE
FCA158
Product specification
TEA1114A
365.7
963.5
1010
1160
1160
1160
1160
1160
1160
104
333
531
764
570
99
99
99
99
99
y