tea1114auh NXP Semiconductors, tea1114auh Datasheet - Page 25

• Manufacturer Part Number: tea1114auh
• Description: Low Voltage Telephone Transmission Circuit With Dialler Interface And Regulated Strong Supply
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2000 Mar 21
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
Low voltage telephone transmission circuit with
dialler interface and regulated strong supply
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
BGA, SQFP
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
(4)
, SO, SOJ
PACKAGE
25
suitable
not suitable
not suitable
suitable
not recommended
not recommended
(2)
WAVE
(3)
SOLDERING METHOD
(4)(5)
(6)
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
TEA1114A
(1)
DIPPING
suitable