tza3034 NXP Semiconductors, tza3034 Datasheet - Page 10

• Manufacturer Part Number: tza3034
• Description: Sdh/sonet Stm1/oc3 Postamplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134.
HANDLING
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the V
connections in any order.
THERMAL CHARACTERISTICS
Note
1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
1999 Nov 03
V
V
I
P
T
T
T
R
n
SYMBOL
stg
j
amb
SYMBOL
CC
n
tot
th(j-a)
SDH/SONET STM1/OC3 postamplifier
57
in still air.
57
1.6 mm FR4 epoxy printed-circuit board with 35 m thick copper traces. The measurements are performed
supply voltage
DC voltage
DC current
total power dissipation
storage temperature
junction temperature
ambient temperature
thermal resistance from junction to ambient note 1
pins DIN, DINQ, CF, JAM and RSET
pins STQ, ST, DOUTQ and DOUT
pin V
pins DIN, DINQ, CF and JAM
pins STQ, ST, DOUTQ and DOUT
pin V
pin RSET
SO16 package
TSSOP16 package
ref
ref
CC
PARAMETER
and GND pads first, the remaining pads may then be bonded to their external
PARAMETER
10
CONDITION
V
0.5
0.5
0.5
1
25
2
2
65
40
CC
MIN.
VALUE
2
115
150
+6
V
V
+3.2
+1
+10
+2.5
+2
300
+150
150
+85
CC
CC
MAX.
Product specification
+ 0.5
+ 0.5
TZA3034
UNIT
V
V
V
V
mA
mA
mA
mA
mW
K/W
K/W
C
C
C
UNIT