pip3103-t NXP Semiconductors, pip3103-t Datasheet
pip3103-t
Related parts for pip3103-t
pip3103-t Summary of contents
Page 1
... Total power dissipation D T Continuous junction temperature j R Drain-source on-state resistance DS(ON) FUNCTIONAL BLOCK DIAGRAM INPUT LOGIC AND PROTECTION Fig.1. Elements of the TOPFET. PIN CONFIGURATION Product specification PIP3103-T MAX. UNIT 50 V 0.7 A 1.8 W 150 ˚C 200 m DRAIN CLAMP POWER MOSFET RIG SOURCE ...
Page 2
... C = 250 pF 1.5 k CONDITIONS T 25˚C; I < D(lim) inductive load T 125˚ mA 250 Hz REQUIRED CONDITION CONDITIONS Mounted on any PCB Mounted on PCB of fig Product specification PIP3103-T MIN. MAX. UNIT - 50 - self limiting - 1.8 -55 150 - 150 MIN. MAX. UNIT - 2 MIN ...
Page 3
... 25˚C unless otherwise specified mb CONDITIONS normal operation; protection latched; 1 reset time t 100 < IS1 IS2 Product specification PIP3103-T MIN. TYP. MAX 0. 100 = 25 ˚ 380 = 25 ˚C - 150 200 mb MIN ...
Page 4
... IS CONDITIONS T 25 ˚ 25˚C unless otherwise specified mb CONDITIONS 300 not applicable according to the formula DSC D 4 Product specification PIP3103-T MIN. TYP. MAX. UNIT 0.8 1.3 1.7 0 0 1.6 - 150 165 - MIN. TYP. MAX. UNIT - 5 12 ...
Page 5
... DS(ON VIS / 25˚C. Fig.7. Typical transfer characteristics 300 f Product specification PIP3103-T Normalised RDS(ON) = f(Tj 100 25˚ 100 mA; V DS(ON MAX. TYP VIS / V = 25˚ f(V ); conditions 100 mA, t ...
Page 6
... VIS / V = 1000 3V 800 5V 600 4V 400 200 0 0 100 150 Fig.13. Typical overload protection response time. 6 Product specification PIP3103-T MAX. TYP. MIN 100 Tj / ˚C Fig.11. Input threshold voltage. = f(T ); conditions mA VIS / f(V ) ...
Page 7
... L IDSS 100 -50 Fig.18. Typical drain source leakage current 300 DSS VDD VDS measure D.U. Product specification PIP3103-T VDS VIS - 100 120 time / us to obtain I = 250 mA 100 Tj / ˚C = f(T ); conditions ...
Page 8
... Philips Semiconductors PowerMOS transistor Logic level TOPFET Zth j-amb / ( 1E+ 0.5 0.2 1E+01 0.1 0.05 0.02 1 1E-01 0 1E-02 1E-07 Fig.19. Transient thermal impedance, mounted on SOT223 PCB. June 2001 P D 1E-05 1E-03 1E- f(t); parameter j Product specification PIP3103 1E+01 1E+03 Rev 1.000 ...
Page 9
... scale 0.32 6.7 3.7 7.3 1.1 0.95 4.6 2.3 0.22 6.3 3.3 6.7 0.7 0.85 REFERENCES JEDEC EIAJ Fig.20. SOT223 surface mounting package 9 Product specification PIP3103-T SOT223 detail 0.2 0.1 0.1 EUROPEAN ISSUE DATE PROJECTION 96-11-11 97-02- Rev 1.000 ...
Page 10
... Fig.21. Soldering pattern for surface mounting. June 2001 PRINTED CIRCUIT BOARD Dimensions in mm. 60 6.3 Fig.22. PCB for thermal resistance and power rating. PCB: FR4 epoxy glass (1.6 mm thick), 10 Product specification PIP3103-T Dimensions in mm 4.5 4 copper laminate (35 m thick). Rev 1.000 ...
Page 11
... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 11 Product specification PIP3103-T Rev 1.000 ...