km416rd8ac Samsung Semiconductor, Inc., km416rd8ac Datasheet - Page 5

• Manufacturer Part Number: km416rd8ac
• Description: 128/144mbit Rdram 256k X 16/18 Bit X 2*16 Dependent Banks Direct Rdramtm
• Manufacturer: Samsung Semiconductor, Inc.

KM416RD8AC(D)/KM418RD8AC(D)
ROW
ROW
Pinouts and Definitions
Normal Package
This table shows the pin assignments of the normal RDRAM package.
Mirrored Package
This table shows the pin assignments of the mirrored RDRAM package.
COL
COL
12
11
10
12
11
10
9
8
7
6
5
4
3
2
1
9
8
7
6
5
4
3
2
1
Table 1 : a. Center-Bonded Device
Table 2: a.Center-Bonded Device
VCMOS
VCMOS
DQA8
DQA8
DQA7
DQA7
GND
GND
CMD
GND
GND
CMD
GND
GND
SCK
SCK
A
A
*
*
DQA4
DQA5
DQA6
DQA3
DQA3
DQA6
DQA5
DQA4
VDD
GND
GND
VDD
B
B
DQA2
DQA1
DQA0
DQA0
DQA1
DQA2
VDD
CFM
GND
VDD
VDD
VDD
VDD
GND
CFM
VDD
C
C
CFMN
GNDa
CTMN
CTMN
GNDa
CFMN
VDDa
VREF
VREF
VDDa
GND
GND
D
D
(Top View For Mirrored Package)
VDD
GND
CTM
CTM
GND
VDD
RQ5
RQ6
RQ7
RQ7
RQ6
RQ5
E
E
(Top View For Normal Package)
GND
VDD
VDD
GND
RQ3
RQ2
RQ1
RQ4
RQ4
RQ1
RQ2
RQ3
F
F
DQB0
DQB1
DQB2
DQB2
DQB1
DQB0
GND
GND
VDD
VDD
RQ0
VDD
VDD
RQ0
VDD
VDD
Page 2
G
G
DQB4
DQB5
DQB6
DQB3
DQB3
DQB6
DQB5
DQB4
GND
GND
VDD
VDD
H
H
VCMOS
VCMOS
DQB8
DQB8
DQB7
DQB7
GND
GND
SIO1
SIO0
GND
GND
SIO0
SIO1
GND
GND
J
J
*
*
b. Top marking example
b.
* DQA8/DQB8 are just used for
For mirrored package, pin #1(ROW 1, COL A)
is located at the A1 postion on the top side and
the A1 position is marked by the alphabet
For normal package, pin #1(ROW 1, COL A) is
located at the A1 position on the top side and
the A1 position is marked by the marker
Top marking
NC(No Connection) in 128Mb RDRAM.
144Mb RDRAM. These two pins are
Rev. 1.01 Oct. 1999
Direct RDRAM
M
KM4xxRD8AD
SEC KOREA
KM4xxRD8AC
example of normal package
SEC KOREA
Top View
Chip
of mirrored package
“
“
™
M
“
“
.
.