bcm856ds/dg NXP Semiconductors, bcm856ds/dg Datasheet
bcm856ds/dg
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bcm856ds/dg Summary of contents
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... BCM856BS; BCM856BS/DG BCM856DS; BCM856DS/DG PNP/PNP matched double transistors Rev. 01 — 7 August 2008 1. Product profile 1.1 General description PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic packages. The transistors are fully isolated internally. Table 1. Type number BCM856BS BCM856BS/DG BCM856DS BCM856DS/DG 1.2 Features ...
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... The smaller of the two values is subtracted from the larger value. 2. Pinning information Table 3. Pin Ordering information Table 4. Type number BCM856BS BCM856BS/DG BCM856DS BCM856DS/DG BCM856BS_BCM856DS_1 Product data sheet Quick reference data …continued Parameter h matching FE V matching BE2 BE Pinning Description emitter TR1 ...
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... BCM856BS (SOT363) BCM856BS/DG (SOT363) BCM856DS (SOT457) BCM856DS/DG (SOT457) total power dissipation BCM856BS (SOT363) BCM856BS/DG (SOT363) BCM856DS (SOT457) BCM856DS/DG (SOT457) junction temperature ambient temperature storage temperature Rev. 01 — 7 August 2008 PNP/PNP matched double transistors [1] Marking code *BS PB* ...
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... Product data sheet BCM856BS; BCM856DS Thermal characteristics thermal resistance from junction to ambient BCM856BS (SOT363) BCM856BS/DG (SOT363) BCM856DS (SOT457) BCM856DS/DG (SOT457) thermal resistance from junction to ambient BCM856BS (SOT363) BCM856BS/DG (SOT363) BCM856DS (SOT457) BCM856DS/DG (SOT457) Characteristics Parameter Conditions collector-base cut-off V CB current ...
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... NXP Semiconductors Table unless otherwise specified. amb Symbol Per device h /h FE1 FE2 V V BE1 [1] V BEsat [ [3] The smaller of the two values is taken as the numerator. [4] The smaller of the two values is subtracted from the larger value. ...
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... NXP Semiconductors 0.20 I (mA (A) 0.16 0.12 0.08 0. amb Fig 1. Collector current as a function of collector-emitter voltage; typical values 1.3 V BEsat (V) 1.1 0.9 (1) (2) 0.7 (3) 0.5 0 amb ( amb ( 100 C amb Fig 3. Base-emitter saturation voltage as a function of collector current; typical values ...
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... NXP Semiconductors (V) 0.8 0.6 0 amb Fig 5. Base-emitter voltage as a function of collector current; typical values (pF MHz amb Fig 7. Collector capacitance as a function of collector-base voltage; typical values BCM856BS_BCM856DS_1 Product data sheet BCM856BS ...
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... NXP Semiconductors 8. Application information TR1 006aaa524 Fig 9. Current mirror 9. Test information 9.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. ...
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... NXP Semiconductors 11. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BCM856BS BCM856BS/DG SOT363 BCM856DS BCM856DS/DG SOT457 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 12. Soldering Fig 13. Refl ...
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... NXP Semiconductors 4.5 Fig 14. Wave soldering footprint SOT363 (SC-88) 3.3 Fig 15. Reflow soldering footprint SOT457 (SC-74) BCM856BS_BCM856DS_1 Product data sheet BCM856BS; BCM856DS 1.3 1.3 2.45 5.3 3.45 1.95 0.95 2.825 0. 2.4 Rev. 01 — 7 August 2008 PNP/PNP matched double transistors 1.5 0.3 2.5 1.5 Dimensions in mm preferred transport direction during soldering 0.55 solder lands 0. solder resist ...
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... NXP Semiconductors 1.475 5.05 1.475 Fig 16. Wave soldering footprint SOT457 (SC-74) BCM856BS_BCM856DS_1 Product data sheet BCM856BS; BCM856DS PNP/PNP matched double transistors 5.3 1. 2.85 Rev. 01 — 7 August 2008 1 solder lands solder resist 0. occupied area Dimensions in mm preferred transport direction during soldering sot457_fw © NXP B.V. 2008. All rights reserved. ...
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... NXP Semiconductors 13. Revision history Table 10. Revision history Document ID Release date BCM856BS_BCM856DS_1 20080807 BCM856BS_BCM856DS_1 Product data sheet BCM856BS; BCM856DS PNP/PNP matched double transistors Data sheet status Change notice Product data sheet - Rev. 01 — 7 August 2008 Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 16. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Packing information ...