bcm856ds/dg NXP Semiconductors, bcm856ds/dg Datasheet - Page 9

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bcm856ds/dg

Manufacturer Part Number
bcm856ds/dg
Description
Pnp/pnp Matched Double Transistors
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
11. Packing information
12. Soldering
BCM856BS_BCM856DS_1
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number
BCM856BS
BCM856BS/DG SOT363
BCM856DS
BCM856DS/DG SOT457
Fig 13. Reflow soldering footprint SOT363 (SC-88)
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
2.35
Packing methods
1.5
Package Description
SOT363
SOT457
(4 )
0.6
(4 )
0.5
Rev. 01 — 7 August 2008
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
(4 )
(4 )
0.5
0.6
2.65
1.8
BCM856BS; BCM856DS
(2 )
0.6
0.4 (2 )
PNP/PNP matched double transistors
Section
[1]
Dimensions in mm
15.
[2]
[3]
[2]
[3]
[2]
[3]
[2]
[3]
Packing quantity
3000
-115
-125
-115
-125
-115
-125
-115
-125
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot363_fr
10000
-135
-165
-135
-165
-135
-165
-135
-165
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