gs82032agt-6i GSI Technology, gs82032agt-6i Datasheet

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gs82032agt-6i

Manufacturer Part Number
gs82032agt-6i
Description
2mb Synchronous Burst Sram
Manufacturer
GSI Technology
Datasheet
TQFP
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipelined opera-
• Single Cycle Deselect (SCD) operation
• 3.3 V +10%/–5% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipelined mode
• Byte Write (BW) and/or Global Write (GW) operation
• Common data inputs and data outputs
• Clock Control, registered, address, data, and control
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC standard 100-lead TQFP package
• RoHS-compliant 100-lead TQFP package available
Functional Description
Applications
The GS82032A is a 2,097,152-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enables (E
control inputs (ADSP, ADSC, ADV), and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynchronous inputs. Burst
cycles can be initiated with either ADSP or ADSC inputs. In
Burst mode, subsequent burst addresses are generated
internally and are controlled by ADV. The burst address
Rev: 1.13 1/2009
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
tion
Through
Pipeline
3-1-1-1
2-1-1-1
Flow
tCycle
tCycle
t
I
t
I
KQ
DD
KQ
DD
1
2Mb Synchronous Burst SRAM
, E
2
, E
155 mA
100 mA
3
5.5 ns
3.2 ns
9.1 ns
), address burst
-180
8 ns
Parameter Synopsis
140 mA
90 mA
3.5 ns
8.5 ns
10 ns
-166
1/22
6 ns
64K x 32
130 mA
10.5 ns
85 mA
6.6 ns
3.8 ns
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
Burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output Register can be controlled by
the user via the FT mode pin (Pin 14 in the TQFP). Holding
the FT mode pin low places the RAM in Flow Through mode,
causing output data to bypass the Data Output Register.
Holding FT high places the RAM in Pipelined mode,
activating the rising-edge-triggered Data Output Register.
SCD Pipelined Reads
The GS82032A is an SCD (Single Cycle Deselect) pipelined
synchronous SRAM. DCD (Dual Cycle Deselect) versions are
also available. SCD SRAMs pipeline deselect commands one
stage less than read commands. SCD RAMs begin turning off
their outputs immediately after the deselect command has been
captured in the input registers.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS82032A operates on a 3.3 V power supply and all
inputs/outputs are 3.3 V- and 2.5 V-compatible. Separate
output power (V
from the internal circuit.
-150
9 ns
GS82032AT-180/166/150/133/100/66/4/5/6
-133 (-4)
115 mA
80 mA
7.5 ns
12 ns
10 ns
4 ns
DDQ
-100 (-5)
) pins are used to decouple output noise
90 mA
65 mA
10 ns
15 ns
12 ns
5 ns
-66 (-6)
12.5 ns
65 mA
50 mA
20 ns
18 ns
6 ns
© 2000, GSI Technology
3.3 V and 2.5 V I/O
180 MHz–66 MHz
3.3 V V
DD

Related parts for gs82032agt-6i

gs82032agt-6i Summary of contents

Page 1

... MHz–66 MHz 3 3.3 V and 2.5 V I/O ) pins are used to decouple output noise DDQ -100 (-5) - © 2000, GSI Technology DD ...

Page 2

... DDQ DDQ DDQ © 2000, GSI Technology ...

Page 3

... Burst address counter advance enable; active low Address Strobe (Processor, Cache Controller); active low Sleep Mode control; active high Flow Through or Pipeline mode; active low Linear Burst Order mode; active low Core power supply I/O and Core Ground Output driver power supply 3/22 © 2000, GSI Technology ...

Page 4

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6 GS82032A Block Diagram Counter Load Register D Q Register D Q Register D Q Register D Q Register D Q Register D Q Register 4/22 A Memory Array – DQx1 DQx8 © 2000, GSI Technology ...

Page 5

... Note: The burst counter wraps to initial state on the 5th clock. 5/22 Function Linear Burst Interleaved Burst Flow Through Pipeline Active Standby A[1:0] A[1:0] A[1:0] A[1: © 2000, GSI Technology ...

Page 6

... may be used in any combination with BW to write single or multiple bytes Notes © 2000, GSI Technology ...

Page 7

... © 2000, GSI Technology High-Z X High-Z X High ...

Page 8

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6 Simplified State Diagram X Deselect First Write Burst Write 8/ First Read Burst Read and Write ( BW, and GW) control © 2000, GSI Technology ...

Page 9

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6 Simplified State Diagram with G X Deselect First Write Burst Write 9/ First Read Burst Read CR © 2000, GSI Technology ...

Page 10

... DDQ –0 +0.5 ( 4.6 V max.) DD +/–20 +/–20 1.5 –55 to 125 –55 to 125 Typ. Max. Unit 3 +0.3 — — 0.8 V    2.375 V (i.e., 2.5 V I/O) DDQ © 2000, GSI Technology Unit Notes ...

Page 11

... OUT OUT Conditions 2 V/ns 1.25 V 1.25 V Fig. 1& 2 50 * 30pF Distributed Test Jig Capacitance 11/22 20% tKC Typ. Max Output Load 2 2.5 V 225 225 5pF © 2000, GSI Technology Unit ...

Page 12

... DDQ –4 mA DDQ 12/22 Min – – –  V –300 uA IL – – 2.375 V 1 3.135 V 2.4 V © 2000, GSI Technology Max 300 0.4 V ...

Page 13

... Rev: 1.13 1/2009 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6 13/22 © 2000, GSI Technology ...

Page 14

... GSI Technology -66 Unit Min Max 12.5 — ns — 1.5 — ns 1.5 — — ns — — — ns 1.3 — ns 1.5 — — ...

Page 15

... ADSC initiated read and E3 only sampled with ADSP and ADSC tS tOHZ tH Q(A) D(B) 15/22 Read C+1 Read C+2 Read C+3 Cont Burst Read Burst Read Deselected with E1 E1 masks ADSP tKQ tLZ Q(C) Q(C+1) Q(C+2) Q(C+3) © 2000, GSI Technology Deselect tKQX tHZ ...

Page 16

... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6 Flow Through Mode Timing Cont Write B Read C Read C+1 Read C+2 Read C+3 Read C tKL tKL tKC tKC Fixed High tS tH ADSC initiated read tKQ tOHZ tLZ D(B) Q(C) 16/22 Cont Deselect Deselected with E1 tHZ Q(C+1) Q(C+2) Q(C+3) Q(C) © 2000, GSI Technology tKQX ...

Page 17

... Rev: 1.13 1/2009 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6 Sleep Mode Timing tKH tKH tKC tKC tKL tKL tZZS tZZH 17/22 tZZR © 2000, GSI Technology ...

Page 18

... Rev: 1.13 1/2009 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6 GS82032A Output Driver Characteristics 1 1 Out (Pull Dow Out (Pull Up) DDQ 18/22 V DDQ I Out VOut V SS 2.5 3 3 © 2000, GSI Technology ...

Page 19

... All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion. Rev: 1.13 1/2009 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032AT-180/166/150/133/100/66/4/5/6  0.10 0.15 1.40 1.45 0.30 0.40 — 0.20 e 22.0 22.1 20.0 20.1 16.0 16.1 b 14.0 14.1 0.65 — 0.60 0.75 1.00 — 0.10 7 — 19/ © 2000, GSI Technology ...

Page 20

... GS82032AGT-100 64K x 32 GS82032AGT-66 64K x 32 GS82032AGT-4 64K x 32 GS82032AGT-5 64K x 32 GS82032AGT-6 64K x 32 GS82032AGT-180I 64K x 32 GS82032AGT-166I 64K x 32 GS82032AGT-150I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS82032AT-150IT. ...

Page 21

... GS82032AGT-4I 64K x 32 GS82032AGT-5I 64K x 32 GS82032AGT-6I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS82032AT-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipelined mode and the latency (ns) in Flow Through mode. ...

Page 22

... Removed all references to 200 MHz parts (no longer active) Content • Complete rewrite of datasheet in order to reflect parts Content available • Reactiviated 180 MHz speed bin Content • Updated format • Added Pb-free information for TQFP Content • Updated Pb-free to RoHS-compliant Content 22/22 © 2000, GSI Technology ...

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