buk9219 NXP Semiconductors, buk9219 Datasheet - Page 4

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buk9219

Manufacturer Part Number
buk9219
Description
Buk9219-55a Trenchmos Tm Logic Level Fet
Manufacturer
NXP Semiconductors
Datasheet

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7. Thermal characteristics
Table 4:
Philips Semiconductors
9397 750 07642
Product specification
Symbol Parameter
R
R
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
th(j-a)
th(j-mb)
thermal resistance from junction to ambient
thermal resistance from junction to mounting
base
Thermal characteristics
7.1 Transient thermal impedance
Z th(j-mb)
0.001
0.01
(K/W)
0.1
10
1
10 -6
= 0.5
10 -5
Rev. 01 — 24 October 2000
10 -4
Conditions
minimum footprint, FR4 board
Figure 4
10 -3
10 -2
P
10 -1
t p
TrenchMOS™ logic level FET
T
BUK9219-55A
t p (s)
03nb65
=
© Philips Electronics N.V. 2000. All rights reserved.
t p
T
t
1
Value Unit
71.4
1.3
4 of 13
K/W
K/W

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