mf1s7009 NXP Semiconductors, mf1s7009 Datasheet - Page 28
mf1s7009
Manufacturer Part Number
mf1s7009
Description
Mainstream Contactless Smart Card Ic For Fast And Easy Solution Development
Manufacturer
NXP Semiconductors
Datasheet
1.MF1S7009.pdf
(34 pages)
NXP Semiconductors
14. Package outline
MF1S7009
Product data sheet
PUBLIC
Fig 20. Package outline SOT500-2
PLLMC: plastic leadless module carrier package; 35 mm wide tape
DIMENSIONS (mm are the original dimensions)
Note
1. Total package thickness, exclusive punching burr.
UNIT
mm
VERSION
OUTLINE
SOT500-2
max.
0.33
A
(1)
35.05
34.95
D
IEC
- - -
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
0
All information provided in this document is subject to legal disclaimers.
JEDEC
- - -
REFERENCES
Rev. 3 — 26 July 2010
193031
scale
JEITA
10
D
- - -
Mainstream contactless smart card IC
A
20 mm
PROJECTION
EUROPEAN
detail X
X
MF1S7009
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
03-09-17
06-05-22
SOT500-2
28 of 34
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