mf1s7009 NXP Semiconductors, mf1s7009 Datasheet - Page 4

• Manufacturer Part Number: mf1s7009
• Description: Mainstream Contactless Smart Card Ic For Fast And Easy Solution Development
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Pinning information
7. Mechanical specification
MF1S7009
Product data sheet
PUBLIC
6.1
Table 2.
Table 3.
Contactless interface module
Antenna contacts
LA
LB
Wafer
diameter
maximum diameter after foil expansion
thickness
flatness
Potential Good Dies per Wafer (PGDW)
Wafer backside
material
treatment
roughness
Chip dimensions
step size
Smart card contactless module
Fig 3.
Contact assignments for SOT500-2 (MOA4)
Bonding pad assignments to smart card contactless module
Specifications
All information provided in this document is subject to legal disclaimers.
LA
Symbol
LA
LB
Rev. 3 — 26 July 2010
193031
MF1S7009DA4
Description
Antenna coil connection LA
Antenna coil connection LB
top view
Mainstream contactless smart card IC
200 mm typical (8 inches)
210 mm
120 μm ± 15 μm
not applicable
18482
Si
ground and stress relieve
R
R
x = 1231 μm
y = 1280 μm
a
t
max = 2 μm
max = 0.2 μm
001aam200
MF1S7009
LB
© NXP B.V. 2010. All rights reserved.
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