BZT52H PHILIPS [NXP Semiconductors], BZT52H Datasheet - Page 3

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BZT52H

Manufacturer Part Number
BZT52H
Description
Single Zener diodes in a SOD123F package
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet

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Philips Semiconductors
5. Limiting values
6. Thermal characteristics
9397 750 15082
Product data sheet
Table 5:
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 6:
[1]
[2]
[3]
Symbol
I
I
P
P
T
T
T
Symbol
R
R
F
ZSM
j
amb
stg
ZSM
tot
th(j-a)
th(j-sp)
t
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering point of cathode tab.
p
= 100 s; square wave; T
Parameter
forward current
non-repetitive peak
reverse current
non-repetitive peak
reverse power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Limiting values
Thermal characteristics
Rev. 01 — 22 December 2005
j
= 25 C prior to surge
Conditions
T
Conditions
in free air
amb
25 C
Single Zener diodes in a SOD123F package
[1]
[2]
[3]
Min
-
-
-
-
-
-
65
65
BZT52H series
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
[1]
[2]
[3]
Min
-
-
-
Max
250
see
and
40
375
830
150
+150
+150
Typ
-
-
-
Table
10
Max
330
150
70
8,
9
2
2
.
.
Unit
mA
W
mW
mW
Unit
K/W
K/W
K/W
3 of 10
C
C
C

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