74LVC3G14GT,115 NXP Semiconductors, 74LVC3G14GT,115 Datasheet
74LVC3G14GT,115
Specifications of 74LVC3G14GT,115
74LVC3G14GT-G
935278934115
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74LVC3G14GT,115 Summary of contents
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Triple inverting Schmitt trigger with 5 V tolerant input Rev. 8 — 19 August 2010 1. General description The 74LVC3G14 provides three inverting buffers with Schmitt trigger action. The inputs can be driven from either 3 ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name −40 °C to +125 °C 74LVC3G14DP −40 °C to +125 °C 74LVC3G14DC −40 °C to +125 °C 74LVC3G14GT −40 °C to +125 °C 74LVC3G14GF −40 °C to +125 °C 74LVC3G14GD 74LVC3G14GM −40 °C to +125 °C − ...
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... NXP Semiconductors 6. Functional diagram 001aah728 Fig 1. Logic symbol 7. Pinning information 7.1 Pinning 74LVC3G14 GND 001aag081 Fig 4. Pin configuration SOT505-2 and SOT765-1 74LVC3G14 Product data sheet Triple inverting Schmitt trigger with 5 V tolerant input 001aah729 Fig 2. IEC logic symbol Fig 5. Pin configuration SOT833-1, SOT1089, SOT1116 and SOT1203 All information provided in this document is subject to legal disclaimers ...
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... NXP Semiconductors 74LVC3G14 GND 4 Transparent top view Fig 6. Pin configuration SOT996-2 7.2 Pin description Table 3. Pin description Symbol Pin SOT505-2, SOT765-1, SOT833-1, SOT1089, SOT996-2, SOT1116 and SOT1203 1A, 2A 1Y, 2Y GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level ...
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... NXP Semiconductors 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
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... NXP Semiconductors 11. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter = −40 °C to +85 °C T amb V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I power-off leakage current OFF I supply current CC Δ ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I power-off leakage current OFF I supply current CC ΔI additional supply current CC [1] All typical values are measured at maximum V Table 8. Transfer characteristics Voltages are referenced to GND (ground = 0 V; for test circuit see ...
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... NXP Semiconductors 12. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter Conditions t propagation delay nA to nY; see power dissipation capacitance [1] Typical values are measured the same as t and PLH PHL [ used to determine the dynamic power dissipation (P PD × ...
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... NXP Semiconductors Table 10. Measurement points 1. 2.7 V 2 3 5.5 V Test data is given in Table R = Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. EXT Fig 9 ...
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... NXP Semiconductors Fig 12. Typical transfer characteristics 15. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula add P = additional power dissipation (μW); add f = input frequency (MHz input rise time (ns input fall time (ns ...
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... NXP Semiconductors Linear change of V between 0 2.0 V. All values given are typical unless otherwise specified. I (1) Positive-going edge. (2) Negative-going edge. Fig 13. Δ function of V CC(AV ≈ --------------------- f = × T 0.8 RC Fig 14. Relaxation oscillator 74LVC3G14 Product data sheet Triple inverting Schmitt trigger with 5 V tolerant input 50 Δ ...
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... NXP Semiconductors 16. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1. 0.5 mm terminal 1 index area (2) (4× terminal 1 index area Dimensions (1) Unit max 0.5 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 19. Package outline SOT996-2 (XSON8U) ...
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... NXP Semiconductors XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.65 mm 0.5 0.00 ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.25 mm nom 0.15 1.20 min 0.12 1.15 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors 17. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic UTLP Ultra-Thin Leadless Package 18. Revision history Table 13. Revision history Document ID Release date 74LVC3G14 v.8 20100819 • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 20. Contact information For more information, please visit: For sales office addresses, please send an email to: 74LVC3G14 Product data sheet Triple inverting Schmitt trigger with 5 V tolerant input 19 ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 4 9 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13 Waveforms ...