NTVS3141P_09 ONSEMI [ON Semiconductor], NTVS3141P_09 Datasheet

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NTVS3141P_09

Manufacturer Part Number
NTVS3141P_09
Description
−20 V, −3.7 A, 85 m, Single P−Channel, CSP 1.0x1.5x0.65 mm
Manufacturer
ONSEMI [ON Semiconductor]
Datasheet
NTVS3141P
Power MOSFET
−20 V, −3.7 A, 85 mW, Single P−Channel,
CSP 1.0x1.5x0.65 mm
Features
Applications
1. Surface−mounted on FR4 board using 1 inch sq pad size
2. Surface−mounted on FR4 board using 77.3 sq mm min pad, 2 oz Cu.
© Semiconductor Components Industries, LLC, 2009
March, 2009 − Rev. 0
MAXIMUM RATINGS
THERMAL RESISTANCE RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 1)
Power Dissipation
(Note 2)
Pulsed Drain Current
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(IR/Convection)
Junction−to−Ambient – Steady State
(Note 1)
Junction−to−Ambient – Steady State
(Note 2)
Low R
Chip Scale Packaging
High Power Density (A/mm
This is a Pb−Free Device
Load Switch in Cell Phone, DSC, PMP, GPS, PC’s
Battery Charging Switch
(Cu area = 1 in sq [2 oz] including traces)
DS(on)
at Low Gate Voltage
Rating
Rating
Steady
Steady
Steady
Steady
State
State
State
State
(T
J
= 25°C unless otherwise noted)
T
T
T
T
t
p
2
A
A
A
A
)
= 10 ms
= 25°C
= 25°C
= 25°C
= 25°C
T
Symbol
Symbol
J
V
R
R
V
, T
I
P
P
T
DSS
DM
I
I
I
θJA
θJA
GS
D
D
S
D
D
L
STG
−55 to 150
Value
−3.7
−2.9
−1.1
Max
−20
−15
250
133
"8
1.5
0.9
83
1
°C/W
°C/W
Unit
Unit
°C
°C
W
W
V
V
A
A
A
A
†For information on tape and reel specifications,
NTVS3141PT2G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
V
(BR)DSS
−20 V
Device
PIN CONNECTION AND MARKING
ORDERING INFORMATION
G
3141 = Specific Device Code
WW
http://onsemi.com
P−Channel MOSFET
6 PIN FLIP−CHIP
123 mΩ @ −2.5 V
150 mΩ @ −1.8 V
200 mΩ @ −1.5 V
85 mΩ @ −4.5 V
= Work Week
CASE 499BC
R
DIAGRAM
1.0 x 1.5
(Pb−Free)
DS(ON)
Package
CSP−6
S
A1
Publication Order Number:
D
MAX
3000/Tape & Reel
NTVS3141P/D
Shipping
(Note 1)
I
D
−3.7 A
MAX

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NTVS3141P_09 Summary of contents

Page 1

NTVS3141P Power MOSFET −20 V, −3 mW, Single P−Channel, CSP 1.0x1.5x0.65 mm Features • Low R at Low Gate Voltage DS(on) • Chip Scale Packaging • 2 High Power Density (A/mm ) • This is a Pb−Free Device ...

Page 2

MOSFET ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 2) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance On to State Drain ...

Page 3

V = −4.5 V −2 −3 0.5 1.0 1.5 2.0 2.5 −V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0.200 0.160 0.120 0.080 0.040 −V ...

Page 4

C iss 800 600 400 C oss 200 C rss DRAIN−TO−SOURCE VOLTAGE (V) Figure 7. Capacitance Variation 1000 V = − −1 −4 ...

Page 5

TYPICAL PERFORMANCE CURVES 1000 100 D = 0.5 0.2 10 0.1 0.05 0.02 1 0.01 0.1 SINGLE PULSE 0.01 0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 t, TIME (sec) Figure 12. Thermal Response http://onsemi.com 100 1000 ...

Page 6

D PIN A1 REFERENCE È TOP VIEW 0. SIDE VIEW 0. 0.03 C BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components ...

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