S29GL-A SPANSION [SPANSION], S29GL-A Datasheet - Page 7

• Manufacturer Part Number: S29GL-A
• Description: S29GL-A MirrorBit Flash Family
• Manufacturer: SPANSION [SPANSION]

April 22, 2005 S29GL-A_00_A3
Figure 16. Program Operation Timings .................................... 75
Figure 17. Accelerated Program Timing Diagram....................... 75
Figure 18. Chip/Sector Erase Operation Timings ....................... 76
Figure 19. Data# Polling Timings
(During Embedded Algorithms) .............................................. 76
Figure 20. Toggle Bit Timings (During Embedded Algorithms)..... 77
Figure 21. DQ2 vs. DQ6 ........................................................ 77
Table 41. Temporary Sector Unprotect ................................... 77
Figure 22. Temporary Sector Group Unprotect Timing Diagram .. 78
Figure 23. Sector Group Protect and Unprotect Timing Diagram.. 78
Table 42. Alternate CE# Controlled Erase and Program
Operations-S29GL064A ........................................................ 79
Table 43. Alternate CE# Controlled Erase and Program
Operations-S29GL032A ........................................................ 80
Table 44. Alternate CE# Controlled Erase and Program
Operations-S29GL016A ........................................................ 81
Figure 24. Alternate CE# Controlled Write (Erase/Program)
Operation Timings ................................................................ 82
A d v a n c e
S29GL-A MirrorBit™ Flash Family
I n f o r m a t i o n
Erase And Programming Performance . . . . . . . 83
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . 84
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 89
TS048—48-Pin Standard Thin Small Outline Package (TSOP) .............84
TS056—56-Pin Standard Thin Small Outline Package (TSOP) .............. 85
LAA064—64-Ball Fortified Ball Grid Array (BGA) ...................................86
VBN048—48-Ball Fine-pitch Ball Grid Array (BGA)
10x 6 mm Package ............................................................................................... 87
VBK048—Ball Fine-pitch Ball Grid Array (BGA)
8.15x 6.15 mm Package ........................................................................................88
Revision A (October 13, 2004) ........................................................................89
Revision A1 (December 17, 2004)s .................................................................89
Revision A2 (January 28, 2005) .......................................................................89
Revision A3 (April 20, 2005) ............................................................................89
Table 45. TSOP Pin and BGA Package Capacitance ................... 83
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