AD8061-EB Analog Devices, AD8061-EB Datasheet - Page 5

• Manufacturer Part Number: AD8061-EB
• Description: Low-Cost/ 300 MHz Rail-to-Rail Amplifiers
• Manufacturer: Analog Devices

Model
AD8061AR
AD8061ART
AD8062AR
AD8062ARM
AD8063AR
AD8063ART
AD806x-EB
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
Internal Power Dissipation
Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . . 0.8 W
SOT-23-5 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
SOT-23-6 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 W
Input Voltage (Common-Mode) (–V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit Duration
Storage Temperature Range R, RM, SOT-23-5,
Operating Temperature Range . . . . . . . . . . . –40 C to +85 C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . 300 C
NOTES
1
2
REV. A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8061/AD8062/AD8063 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device in free air:
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
8-Lead SOIC Package:
5-Lead SOT-23-5 Package:
6-Lead SOT-23-6 Package:
8-Lead SOIC Package:
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
SOT-23-6 . . . . . . . . . . . . . . . . . . . . . . . . –65 C to +125 C
JA
JA
= 160 C/W;
= 200 C/W;
Temperature Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
JA
JA
= 240 C/W;
= 230 C/W;
2
JC
JC
= 56 C/W
= 44 C/W.
S
JC
JC
1
– 0.2 V) to (+V
= 92 C/W
= 92 C/W
S
– 1.8 V)
Package Description
8-Lead SOIC
5-Lead SOT-23-5
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
6-Lead SOT-23-6
Evaluation Board for AD806xAR
ORDERING GUIDE
V
S
–5–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD806x
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150 C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding a
junction temperature of 175 C for an extended period can result
in device failure. While the AD806x is internally short circuit
protected, this may not be sufficient to guarantee that the
maximum junction temperature (150 C) is not exceeded under
all conditions.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature for AD8061/AD8062/AD8063
2.0
1.5
1.0
0.5
–50 –40 –30
0
8-LEAD SOIC
PACKAGE
SOIC
–20
AD8061/AD8062/AD8063
–10
AMBIENT TEMPERATURE – C
SOT-23-5, -6
0
10
20
WARNING!
30
40
T
50
Package Option
R-8
RT-5
R-8
RM-8
R-8
RT-6
J
= 150 C
ESD SENSITIVE DEVICE
60
70 80
90