RJ80535 Intel, RJ80535 Datasheet - Page 45

• Manufacturer Part Number: RJ80535
• Description: Pentium M Processor
• Manufacturer: Intel

Intel
®
Table 19. Micro-FCBGA Package Dimensions
Pentium
®
NOTE: Overall height as delivered. Values are based on design specifications and tolerances. This dimension
A
A2
b
D
E
D1
E1
F
G
e
K
K1
K2
S
N
-
Pdie
W
M Processor Datasheet
Symbol Parameter
is subject to change based on OEM motherboard design or OEM SMT process.
Overall height, as delivered (Refer to Note 1)
Die height
Ball diameter
Package substrate length
Package substrate width
Die length
Die width
To Package Substrate Center
Die Offset from Package Center
Ball pitch
Package edge keep-out
Package corner keep-out
Die-side capacitor height
Package edge to first ball center
Ball count
Solder ball coplanarity
Allowable pressure on the die for thermal solution
Package weight
Package Mechanical Specifications and Pin Information
2.60
34.9
34.9
Min
-
-
10.56
1.133
1.625
0.82
0.78
7.84
17.5
1.27
479
0.2
4.5
5
7
Max
2.85
35.1
35.1
689
0.7
each
Unit
kPa
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
g
45