S29PL032J SPANSION [SPANSION], S29PL032J Datasheet - Page 99
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S29PL032J
Manufacturer Part Number
S29PL032J
Description
CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control
Manufacturer
SPANSION [SPANSION]
Datasheet
1.S29PL032J.pdf
(106 pages)
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Physical Dimensions
April 7, 2005 31107A62
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
0.05
(2X)
MD
ME
A1
A2
D1
E1
φb
A
D
E
N
e
A1
VBG080—80-Ball Fine-pitch Ball Grid Array 8 x 11 mm Package (PL127J
and PL129J)
C
(A3-A6,B3-B6,L3-L6,M3-M6)
0.18
0.62
0.33
MIN
INDEX MARK
11.00 mm x 8.00 mm NOM
---
10
11.00 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
VBG 080
NOM
N/A
12
80
---
---
---
---
8
SIDE VIEW
TOP VIEW
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
SEATING PLANE
P R E L I M I N A R Y
S29PL127J/S29PL129J/S29PL064J/S29PL032J
NOTE
A
0.05
(2X)
A2
E
B
C
C
e
0.08
0.10 C
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
6
C
e
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
NXφb
M
φ 0.08 M
φ 0.15
L
K
M
C
C A
J
B
H
BOTTOM VIEW
G
D1
F
SD
E
D
7
C
B
A
8
7
6
5
4
3
2
1
3329 \ 16-038.25b
SE
A1 CORNER
7
E1
97