VSC8113QB1 VITESSE [Vitesse Semiconductor Corporation], VSC8113QB1 Datasheet - Page 22

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VSC8113QB1

Manufacturer Part Number
VSC8113QB1
Description
ATM/SONET/SDH 622 Mb/s Transceiver Mux/Demux with Integrated Clock Generation and Clock Recovery
Manufacturer
VITESSE [Vitesse Semiconductor Corporation]
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VSC8113QB1
Manufacturer:
VTIESSE
Quantity:
20 000
ATM/SONET/SDH 622 Mb/s Transceiver Mux/Demux
with Integrated Clock Generation and Clock Recovery
Page 22
ical dimensions in the drawing represent the superset of dimensions for both packages. The significant differ-
ence between the two packages is in the shape and size of the heatspreader which needs to be considered when
attaching a heatsink.
Package Thermal Characteristics
surface configurations are shown in the package drawings. With natural convection, the case to air thermal resis-
tance is estimated to be 27.5
Junction to case thermal resistance is 1.2
The VSC8113 is manufactured in a 100PQFP package which is supplied by two different vendors. The crit-
The VSC8113 is packaged in a thermally enhanced 100PQFP with an embedded heat sink. The heat sink
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
Table 18: Theta Case to Ambient versus Air Velocity
o
C/W. The air flow versus thermal resistance relationship is shown in Table 18.
Air Velocity
VITESSE
VITESSE SEMICONDUCTOR CORPORATION
(LFPM)
SEMICONDUCTOR CORPORATION
100
200
400
600
0
o
C/W
Case to air thermal resistance
o
27.5
23.1
19.8
17.6
C/W
16
VSC8113
Data Sheet
G52154-0, Rev 4.2
3/19/99

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