TDA8360 PHILIPS [NXP Semiconductors], TDA8360 Datasheet - Page 31

• Manufacturer Part Number: TDA8360
• Description: Integrated PAL and PAL/NTSC TV processors
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
PACKAGE OUTLINE
handbook, full pagewidth
SOLDERING
Plastic dual in-line packages
B
The maximum permissible temperature of the solder is
260 C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
March 1994
Y DIP OR WAVE
Dimensions in mm.
Integrated PAL and PAL/NTSC TV
processors
3.2
2.8
1.73
max
52
1
Fig.14 52-lead shrink dual in-line; plastic (SOT247AG).
47.92
47.02
1.778
(25x)
31
R
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 C, it must not be in contact for more than 10 s; if
between 300 and 400 C, for not more than 5 s.
1.3 max
EPAIRING SOLDERED JOINTS
TDA8360; TDA8361; TDA8362
0.53
max
26
27
0.51
min
14.1
13.7
0.18
4.57
max
M
5.08
max
0.32 max
Objective specification
15.80
15.24
15.24
17.15
15.90
MSA267