PCA9691BS NXP [NXP Semiconductors], PCA9691BS Datasheet
PCA9691BS
Related parts for PCA9691BS
PCA9691BS Summary of contents
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PCA9691 8-bit A/D and D/A converter Rev. 02 — 27 January 2010 1. General description The PCA9691 is a single chip, single supply, low power, 8-bit CMOS device with four analog inputs, one analog output and a serial I address ...
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... NXP Semiconductors 3. Ordering information Table 1. Type number Package PCA9691BS PCA9691TS PCA9691T 4. Marking Table 2. Type number PCA9691BS PCA9691TS PCA9691T 5. Block diagram SCL SDA EXT OSC AIN0 AIN1 AIN2 AIN3 AOUT Fig 1. PCA9691_2 Product data sheet Ordering information Name Description HVQFN16 plastic thermal enhanced very thin quad flat package ...
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... Fig 2. Fig 3. Fig 4. PCA9691_2 Product data sheet terminal 1 index area 1 AIN2 AIN3 Transparent top view For mechanical details, see Figure 25. Pin configuration for HVQFN16 (PCA9691BS) AIN0 1 2 AIN1 3 AIN2 AIN3 4 PCA9691TS Top view. For mechanical details, see ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin HVQFN16 TSSOP16 (PCA9691BS) (PCA9691TS) AIN0 15 1 AIN1 16 2 AIN2 1 3 AIN3 [ SDA 7 9 SCL 8 10 OSC 9 11 EXT 10 12 AGND 11 13 VREF 12 14 AOUT ...
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NXP Semiconductors 7.1.1 Address map Table 4. Pin SDA SDA SDA SDA SDA SDA SDA SDA SDA SCL V ...
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NXP Semiconductors Table 4. Pin SCL SCL SDA SDA SDA SDA SCL SCL SDA SCL ...
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NXP Semiconductors The selection of a non-existing input channel results in the highest available channel number being allocated. Therefore, if the auto-increment flag is set, the next selected channel is always channel 0. After power-on all bits of the control ...
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NXP Semiconductors Fig 6. 7.3 D/A conversion The third byte sent to a PCA9691 is stored in the DAC data register and is converted to the corresponding analog voltage using the on-chip DAC. This DAC consists of a resistor divider ...
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NXP Semiconductors In order to release the DAC for a successive approximation A/D conversion cycle, the unity gain amplifier is equipped with a sample and hold circuit. This circuit holds the output voltage while executing the A/D conversion. The formula ...
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NXP Semiconductors Fig 8. protocol S ADDRESS SCL 1 2 SDA V AOUT high-impedance state of previous value held in DAC register Fig 9. D/A conversion sequence 7.3.1 Worst case example An example of the worst case is shown in ...
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NXP Semiconductors The new AOUT value is valid, at the latest, after 8.0 μs so before the rising edge of the 8th bit of the next transferred byte. Therefore, at the full speed of the I output is valid under ...
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NXP Semiconductors The first byte transmitted in a read cycle contains the conversion result code of the previous read cycle. After a Power-On Reset (POR) condition the first byte read is 80h. The protocol The actual speed ...
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NXP Semiconductors Fig 13. A/D conversion characteristics of differential inputs 7.5 Reference voltage For the D/A and A/D conversion either a stable external voltage reference or the supply voltage has to be applied to the resistor divider chain (pins VREF ...
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NXP Semiconductors It is recommended that if the I frequency by half (see the definition of the control byte in If pin EXT is connected to V state allowing to feed an external clock signal to the OSC input. The ...
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NXP Semiconductors 7.7.3 System configuration A device which sends data to the bus is a transmitter, a device which receives data from the bus is a receiver. The device which initiates and terminates a transfer is the master; and the ...
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NXP Semiconductors 2 7.7.5 I C-bus protocol After a start condition a valid hardware address has to be sent to a PCA9691 device. The read/write bit defines the direction of the following single or multiple byte data transfer. For the ...
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NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot ESD stg T amb [1] Pass level; Human Body Model (HBM), ...
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NXP Semiconductors Table 6. Static characteristic Symbol Parameter Reference inputs: pins VREF and AGND V voltage on pin VREF VREF V voltage on pin AGND AGND ...
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NXP Semiconductors 50 Z AOUT (Ω Output impedance near negative power rail ( ° amb DD Fig 22. Output impedance of analog output ...
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NXP Semiconductors 2 Table 7. I C-bus characteristics (see Figure 23). DD Symbol Parameter t fall time of both SDA f and SCL signals t ...
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NXP Semiconductors Table 5 pF; unless otherwise specified. L Symbol Parameter Analog output V AOUT I LO Accuracy s(DAC) f c(DAC) α sup(n) [1] ...
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NXP Semiconductors [1] The linearity error is assured if the internal frequency is changed by setting bit 7 and bit 3 of the control byte to logic 1 (see 11. Application information Inputs must be connected to V connected to ...
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... DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.23 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION IEC SOT629 Fig 25. Package outline SOT629-1 (HVQFN16) of PCA9691BS PCA9691_2 Product data sheet 1 1 ...
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NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...
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NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...
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NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to ...
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NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...
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NXP Semiconductors Fig 28. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations Table 12. Acronym CMOS DAC DC HBM ...
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NXP Semiconductors [2] IEC 60134 — Rating systems for electronic tubes and valves and analogous semiconductor devices [3] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena [4] IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface ...
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NXP Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...