ADSP-BF606 AD [Analog Devices], ADSP-BF606 Datasheet - Page 34

• Manufacturer Part Number: ADSP-BF606
• Description: Blackfin Dual Core
• Manufacturer: AD [Analog Devices]

ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609
Total Power Dissipation
Total power dissipation has two components:
Many operating conditions can also affect power dissipation,
including temperature, voltage, operating frequency, and pro-
cessor activity.
current dissipation for internal circuitry (V
I
voltage (V
power specification for the listed test conditions, including the
dynamic component as a function of voltage (V
frequency.
There are two parts to the dynamic component. The first part is
due to transistor switching in the core clock (CCLK) domain.
This part is subject to an Activity Scaling Factor (ASF) which
represents application code running on the processor core and
L1 memories.
The ASF is combined with the CCLK frequency and V
dependent data to calculate this part. The second part is due to
transistor switching in the system clock (SCLK) domain, which
is included in the I
PROCESSOR — ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in the table may cause perma-
nent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other condi-
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
1
2
3
Parameter
Internal Supply Voltage (V
External (I/O) Supply Voltage (V
Input Voltage
Input Voltage
Output Voltage Swing
Load Capacitance
Storage Temperature Range
Junction Temperature Under Bias
DD_DEEPSLEEP
Applies to 100% transient duty cycle. For other duty cycles see
Applies only when V
Applies to pins TWI_SCL and TWI_SDA.
specifications, the range is V
1. Static, including leakage current
2. Dynamic, due to transistor switching characteristics
DD_INT
specifies static power dissipation as a function of
1, 2
1, 2, 3
Electrical Characteristics on Page 33
) and temperature, and I
DD_EXT
DD_INT
is within specifications. When V
DD_EXT
specification equation.
DD_INT
± 0.2 Volts.
)
DD_EXT
) TBD
Rating
TBD
TBD
TBD
TBD
TBD
TBD
TBD
DD_INT
DD_INT
specifies the total
DD_INT
DD_EXT
).
Rev. PrD | Page 34 of 44 | March 2012
Table
shows the
) and
is outside
DD_INT
11.
Table 11. Maximum Duty Cycle for Input Transient Voltage
1
ESD SENSITIVITY
PROCESSOR — PACKAGE INFORMATION
The information presented in
details about package branding. For a complete listing of prod-
uct availability, see
Table 12. Package Brand Information
1
V
TBD
TBD
TBD
TBD
TBD
Brand Key
ADSP-BF60x
t
pp
Z
ccc
vvvvvv.x
n.n
yyww
Applies to all signal pins with the exception of SYS_CLKIN, SYS_XTAL,
See product names in the
SYS_EXTWAKE.
IN
Min (V)
Figure 9. Product Information on Package
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary protection circuitry, damage
may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to
avoid performance degradation or loss of functionality.
V
TBD
TBD
TBD
TBD
TBD
Preliminary Technical Data
IN
Automotive Products on Page
Max (V)
Automotive Products on Page
Field Description
Product Name
Temperature Range
Package Type
RoHS Compliant Designation
See Ordering Guide
Assembly Lot Code
Silicon Revision
Date Code
Figure 9
Maximum Duty Cycle
TBD
TBD
TBD
TBD
TBD
and
1
Table 12
43.
43.
provides
1