MPC106ARX66CE MOTOROLA [Motorola, Inc], MPC106ARX66CE Datasheet - Page 20

• Manufacturer Part Number: MPC106ARX66CE
• Description: PCI Bridge/Memory Controller
• Manufacturer: MOTOROLA [Motorola, Inc]

1.7 Package Description
The following sections provide the package parameters and the mechanical dimensions for the 106.
1.7.1 Package Parameters
The package parameters are as provided in the following list. The package type is a 21 mm x 25 mm,
304-lead C4 ceramic ball grid array (CBGA).
20
Package outline
Interconnects
Pitch
Solder attach
Solder balls
Maximum module height
Co-planarity specification
MPC106 PCI Bridge/Memory Controller Hardware Specifications
21 mm x 25 mm
303 (16 x 19 ball array minus one)
1.27 mm
63/37 Sn/Pb
10/90 Sn/Pb, 0.89 mm diameter
3.16 mm
0.15 mm