TEA1520T NXP [NXP Semiconductors], TEA1520T Datasheet - Page 10

• Manufacturer Part Number: TEA1520T
• Description: SMPS ICs for low-power systems
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
10. Thermal characteristics
11. Characteristics
TEA152X_3
Product data sheet
Table 5.
[1]
Table 6.
T
positive when flowing into the IC; unless otherwise specified.
Symbol
R
Symbol
Supply
I
I
I
V
V
I
Pulse width modulator
SOPS
V
t
RC oscillator
V
V
t
f
Duty factor regulator: pin REG
V
G
V
CC(oper)
CC(startup)
CC(ch)
drain
sup(xfmr_ring)
ch(RC)
osc
amb
min
max
CC(start)
CC(stop)
det(demag)
RC(min)
RC(max)
REG
clamp(REG)
th(j-a)
v
Thermal resistance R
printed-circuit board. See the TEA152x application notes for details.
= 25 C; no over temperature; all voltages are measured with respect to ground; currents are
Parameter
thermal resistance from junction to ambient in free air
Thermal characteristics
Characteristics
DIP8 package
SO14 package
Parameter
operating supply current
start-up supply current
charge supply current
start voltage
stop supply voltage
current on pin DRAIN
minimum duty factor
maximum duty cycle
demagnetization detection
voltage
transformer ringing
suppression time
minimum voltage on pin RC
maximum voltage on pin RC
charge time on pin RC
oscillator frequency
voltage on pin REG
voltage gain
clamp voltage on pin REG
th(j-a)
Rev. 03 — 23 March 2009
can be lower when the GND pins are connected to sufficient copper area on the
Conditions
normal operation
start-up
V
undervoltage lockout
V
f = 100 kHz
start of 2nd stroke
error amplifier
I
REG
drain
drain
no auxiliary supply
with auxiliary
supply
= 6 mA
> 60 V
> 60 V
Conditions
SMPS ICs for low-power systems
Min
-
-
9
7.0
-
-
-
-
50
1.0
60
2.4
-
10
2.4
-
-
6
TEA152x
© NXP B.V. 2009. All rights reserved.
[1]
Typ
1.3
180
9.5
7.5
1.5
30
0
75
100
1.5
75
2.5
1
100
2.5
20
-
4
Typ
100
91
Max
1.9
400
10
8.0
2
125
-
-
150
2.0
90
2.6
-
200
2.6
-
7.5
3
Unit
K/W
K/W
10 of 17
Unit
mA
mA
V
V
mA
%
%
mV
mV
V
kHz
V
dB
V
A
A
s
s