ISD5116 WINBOND [Winbond], ISD5116 Datasheet - Page 56

• Manufacturer Part Number: ISD5116
• Description: Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
• Manufacturer: WINBOND [Winbond]

1.
2.
3.
October 2000
ISD 5116 SERIES BONDING PHYSICAL LAYOUT
The backside of die is internally connected to Vss. It MUST NOT be connected to any other
potential or damage may occur.
Double bond recommended.
This figure reflects the current die thickness. Please contact ISD as this thickness may change in
the future.
ISD5116 Series
Die Dimensions
Die Thickness
Pad Opening (min)
X: 4125 um
Y: 8030 um
292.1 um + 12.7 um
90 x 90 microns
3.5 x 3.5 mils
(3)
V
SS A
MIC+
MIC–
V
SSD
ANAOUT+
V
S SD
AD0
ANAOUT– ACA P
SDA ADL
SCL V
SP–
ISD5116
CCD
V
S SA
(1)
V
(2 )
CCD
(UNPACKAGED DIE)
SP+
XCLK
V
CC A
IN T
(2 )
ANA IN
RAC
V
AUX IN
SS A
AUXOUT
Page 55