SA58631TK PHILIPS [NXP Semiconductors], SA58631TK Datasheet
SA58631TK
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SA58631TK Summary of contents
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SA58631 3 W BTL audio amplifier Rev. 01 — 1 December 2005 1. General description The SA58631 is a one channel audio amplifier in a HVSON8 package. It provides power output with a 8 Ω load at ...
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... Table 1: Symbol stb P o THD + N PSRR 5. Ordering information Table 2: Type number SA58631TK 6. Block diagram Fig 1. Block diagram of SA58631 SA58631 Preliminary data sheet Quick reference data Parameter Conditions supply voltage quiescent current standby current output power THD + ...
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... The total voltage loss is < With a supply voltage and an 8 Ω loudspeaker, an output power can be delivered to the load. SA58631 Preliminary data sheet terminal 1 index area MODE 1 SVR 2 SA58631TK IN+ 3 IN− 4 Transparent top view Pin description Pin Description 1 ...
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Philips Semiconductors 8.2 Mode select pin (MODE) The device is in Standby mode (with a very low current consumption) if the voltage at the MODE pin is greater than V range between 1.5 V and V condition is useful to ...
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Philips Semiconductors 11. Static characteristics Table 6: Static characteristics ° Ω amb L Symbol Parameter V supply voltage CC I quiescent current q I standby current ...
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Philips Semiconductors 13. Application information Gain Fig 3. Application diagram of SA58631 BTL differential output configuration 14. Test information 14.1 Test conditions The junction to ambient thermal resistance, R when the exposed die attach paddle is soldered to 5 square ...
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Philips Semiconductors 6 Ω ( 4.0 16 Ω 2 5.0 10.0 Fig 4. Output power versus supply voltage @ 2 THD + heat spreader 14.2 BTL ...
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Philips Semiconductors 16 V MODE (V) 12 standby Fig 6. V versus V MODE CC −20 SVRR (dB) −40 (1) (2) −60 (3) − Ω ...
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Philips Semiconductors 5.0 P ( 3.0 7.5 V 2.0 5 0.6 1.2 Fig 10. Power dissipation versus output power; = 4.0 Ω dB; 1.5 inch L ...
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Philips Semiconductors 3 9 (W) 2.0 7.5 V 1.0 5 1.0 2.0 Fig 16. Power dissipation versus output power; = 8.0 Ω dB; 5 inch L v 100.00 ...
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Philips Semiconductors 2.0 THD + N (%) 1.6 1.2 0.8 0.4 0 0.10 1. Ω THD + Ω Fig 19. THD + N versus frequency SA58631 Preliminary data sheet ...
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Philips Semiconductors 14.3 Single-ended application = 25 ° amb 20 kHz. The Single-Ended (SE) application diagram is shown in Gain Fig 20. SE application circuit configuration The capacitor value combination with the load impedance determines ...
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... The application demo board may be used for evaluation in either BTL or SE configuration as shown in the schematics in 5 square inch heat spreader (total of top and bottom heat spreader area). top layer SA58631TK Gnd MS 47 µ INPUT Fig 21. SA58631TK PCB demo SA58631 Preliminary data sheet Figure 3 and Figure 6.8 k Rev3 6.8 k OUT+ OUT− ...
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Philips Semiconductors 15. Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 e index area ...
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Philips Semiconductors 16. Soldering 16.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 19. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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... Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 13 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 14.1 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . 6 14.2 BTL application . . . . . . . . . . . . . . . . . . . . . . . . . 7 14.3 Single-ended application . . . . . . . . . . . . . . . . 12 14.4 General remarks . . . . . . . . . . . . . . . . . . . . . . . 12 14.5 SA58631TK PCB demo . . . . . . . . . . . . . . . . . 13 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.1 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15 16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15 16.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16 16.5 Package related soldering information . . . . . . 16 17 Abbreviations ...