AT88RF1354_09 ATMEL [ATMEL Corporation], AT88RF1354_09 Datasheet
AT88RF1354_09
Related parts for AT88RF1354_09
AT88RF1354_09 Summary of contents
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Features • Compatible with all ISO/IEC 14443 Type B Compliant Cards, Tags, and Transponders • High Performance 13.56 MHz RF Communications Interface ⎯ ISO/IEC 14443-2 Type B Compliant 106 Kbps Signaling ⎯ ISO/IEC 14443-3 Type B Compliant Frame and Data ...
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Introduction 1.1. Block Diagram Figure 1. Block Diagram RFin Modulator C6 ANT ANT Driver Vss_ANT PLL CLKO 13.56 MHz Type B RF Reader Specification 2 Filter Transmit Command Response 13.56 MHz Xtal1 Xtal2 ResetB ISEL Receive SRAM and Logic ...
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... Proximity Integrated Circuit Card – is the tag/card containing an IC and antenna. PICC: Reader: The AT88RF1354 IC with loop antenna and associated circuitry Reserved for Future Use – is any feature, memory location, or bit that is held as reserved for future RFU: use by the ISO standards committee or by Atmel. ...
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... CRC. When a response is received from the card, the response frame is decoded by AT88RF1354 and the resulting bytes are stored in SRAM buffer memory CRC or frame format error is detected in the response, then bits are set in the Error Register (EREG). After the entire frame has been decoded by AT88RF1354, the host microcontroller reads the TX Data Response over the serial interface ...
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Other Commands The Abort Command can be used to interrupt a Poll Single, Poll Continuous Data operation that is in progress Poll Continuous Command is sent but there is no card in the field, then ...
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Register Summary The AT88RF1354 Command Reference Guide document contains all of the detailed information required by a software developer or embedded systems programmer to use the AT88RF1354 Register Set. See AT88RF1354 Command Reference Guide (doc 5150x). Table 2. Register ...
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... The Register Memory Map in Table 3 shows the field names for each register bit. Read-only registers are colored yellow. Read/Write registers are colored green. Any bit identified as RFU or Reserved for Future Use is reserved for future definition by Atmel; these bits must always remain 0 b. ...
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Status Registers AT88RF1354 contains three read-only registers that provide status information. The operational status of the IC is contained in the SREG Register; by reading this register it can be determined if the RF Field is on and if ...
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Pin List Pin Name 1 V _ANT _ANT SS 3 ANT 4 Xtal1 5 Xtal2 Test1 8 CLKO 9 ResetB 10 ISEL 11 TestD 12 Istat 13 SSB 14 SCK 15 SDI 16 ...
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Power and Ground Pin Descriptions 4.1.1. V [24] CC Supply Voltage for I/O buffers, digital, and analog circuits. V since all digital I/O levels are referenced to V Two V bypass capacitors must be connected between the V CC ...
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Digital Pin Descriptions 4.2.1. ADDR [20] TWI device address select input pin. Selects between two TWI device addresses as shown in Table 4. In SPI communication mode this pin should be connected to Vss. Table 4. TWI Device Address ...
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SDO [19] Serial Data Out pin. In SPI communication mode this pin functions as the serial data output. In TWI communication mode this pin is not used. 4.2.9. SSB [13] SPI Slave Select Bar input pin. In SPI communication ...
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C7 [29] C7 bypass capacitor pin. Bypass capacitance for the analog circuits must be connected between the C7 pin and V A. This capacitor must be placed within the package. Any 47 nF ...
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Typical Application 5.1. Operating Principle Contactless RF smart cards operating at 13.56 Mhz are powered by and communicate with the reader via inductive coupling of the reader antenna to the card antenna. The two loop antennas effectively form a ...
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Application In a typical application the AT88RF1354 reader circuitry and the loop antenna are integrated on a single four layer printed circuit board. The host microcontroller and power supply may reside on the same PCB separate ...
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Electrical Characteristics 6.1. Absolute Maximum Ratings* Operating Temperature (case temp).........−40°C to +85°C Storage Temperature (case temp) .........−65° 150°C Power Dissipation .................................................. 2 Watts Maximum Operating Voltage (V Maximum Operating Voltage (V DC Current: V Pin ...............................................100 mA ...
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Digital I/O Characteristics T = -40° to +85° C (unless otherwise noted) C Symbol Parameter V Input Low Voltage IL V Input High Voltage IH Output Low Voltage V OL1 (SDI pin TWI mode only) R I/O pin Pull-up ...
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TWI Mode Timing T = -40° to +85° 3 4.5 to 5.5 V (unless otherwise noted Symbol Parameter t SCK High pulse width HIGH t SCK Low pulse width LOW ...
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Figure 5. SPI Interface timing requirements 6.3.4. CLKO Output Timing T = -40° to +85° C (unless otherwise noted) C Symbol Parameter f CLKO Output Frequency CLKO CLKO Duty Cycle Note: 1. Typical values at 25° C. Values are based ...
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Typical Characteristics The performance of AT88RF1354 is dependent on the reader circuit, the loop antenna design, the board layout, the specifications of the passive components, the quality of the supply voltages, the quality of the ground, the electrical noise ...
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RF Characteristics 7.3.1. Transmitter Characteristics Tc = -40° to +85° C (unless otherwise noted) Symbol Parameter (3) fc Carrier Frequency M.I. Field Modulation Index ETU Elementary Time Unit EGT Extra Guard Time Note: 1. Typical values ...
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Mechanical 8.1. Thermal Characteristics The AT88RF1354 QFN package thermal characteristics were modeled and characterized by Amkor with JEDEC standard methods using a multilayer JEDEC test board with nine thermal vias on the PCB thermal pad. °C/W and θ is ...
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Package Drawing 8547B–RFID–3/09 13.56 MHz Type B RF Reader Specification 23 ...
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Ordering Information AT88RF1354 is available in the pin QFN package only. Standard delivery format is bulk, in trays. Tape & reel is also available. Ordering Code AT88RF1354-ZU 36 pin QFN thermal package, 6 ...
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Appendix A. The ISO/IEC 14443 Type B RF Signal Interface The ISO 14443 specifications refer to cards. In this section, the reader can interchange the terms “card,” “tag,” and “transponder.” A.1. RF Signal Interface The AT88RF1354 RF communications interface is ...
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Figure A-2. Start of Frame (SOF) and End of Frame (EOF) format requirement Start of Frame End of Frame Last Byte A.4. Reader Data Transmission The unmodulated 13.56 Mhz carrier signal amplitude which is transmitted when the reader is idle ...
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... FWT. The PCD is not permitted to modulate the RF field while waiting for a PICC to respond to a command. Modulation of the RF field during a PICC memory read or write operation may corrupt the operation or cause reset of the PICC. ...
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Figure A-6. Location of the two CRC_B bytes within a frame. SOF The CRC_B polynomial is defined in ISO/IEC 14443 and ISO/IEC 13239 $1021. The initial value of the register used for the CRC_B calculation is all ...
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ID-1 is less than the limits specified in the standard. For tags with antennas smaller than ID-1 size, a higher magnetic field strength is required. The field strength required is inversely proportional to the area ...
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Appendix B. The SPI Serial Interface The SPI Interface mode is selected by shorting the ISEL pin to V AT88RF1354 in SPI mode. The ISTAT signal is used for handshaking between the microcontroller and RF reader. B.1. SPI Interface The ...
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Appendix C. The TWI Serial Interface The TWI Interface mode is selected by shorting the ISEL pin to V AT88RF1354 in TWI mode. TWI ACK polling is not supported; the ISTAT signal is used for handshaking between the microcontroller and ...
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C.2. TWI Device Address The TWI device address is selected with the ADDR address select pin of the AT88RF1354. Figure C-2. TWI Device Address ADDR Pin Bit The AT88RF1354 device requires an 8-bit ...
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Appendix D. QFN Package Mounting Guidelines D.1. Introduction This Appendix provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame ® package. The QFN package is a near chip scale plastic encapsulated package with ...
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D.3. PCB Design Guidelines As shown in Figure D-1. the lands on the package bottom side are rectangular in shape with rounded edges on the inside. Since the package does not have any solder balls, the electrical connection between the ...
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Figure D-2. Solder mask definition for perimeter lands. 0.5 mm and Higher Pitch Parts For the cases where the thermal land dimensions are close to the theoretical maximum discussed above recommended that the thermal pad area should be ...
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D.4.2. Stencil Design for Thermal Pad In order to effectively remove the heat from the package and to enhance the electrical performance, the die paddle needs to be soldered to the PCB thermal pad, preferably with minimum voids. However, eliminating ...
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Figure D-4. Solder Mask Options for Thermal Vias Via Tenting from Top All of these options have pros and cons when mounting the QFN package on the board. While via tenting from the top side may result in smaller voids, ...
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D.4.4. Stencil Thickness and Solder Paste A stencil thickness of 0.125 mm is recommended for 0.4 and 0.5 mm pitch parts. A laser-cut, stainless steel stencil is recommended with electro-polished trapezoidal walls to improve the paste release. Since not enough ...
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The fillet formation is also a function of the PCB land size, the printed solder volume, and the package standoff height. Since there is only limited solder available, higher standoff (controlled by the paste coverage on the thermal pad) may ...
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D.4.6. Reflow Profile The reflow profile and the peak temperature have a strong influence on void formation. Amkor has conducted experiments with the different reflow profiles (ramp-to-peak vs. ramp-hold-ramp), the peak reflow temperatures, and the times above liquidus using Alpha ...
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Figure D-9. Typical PCB mounting process flow. Solder Paste Printing Post Print Inspection Component Placement Pre Reflow Inspection D.6. Rework Guidelines Since solder joints are not fully exposed in the case of QFNs, any retouch is limited to the side ...
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D.6.2. Site Redress After the component has been removed, the site needs to be cleaned properly best to use a combination of a blade-style conductive tool and a desoldering braid. The width of the blade should be matched ...
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... CRC Cyclic Redundancy Check = 16 bit RF Communication Error Detection Code. CRC_B Cyclic Redundancy Check, Type B. CRF CryptoRF® . Atmel ISO/IEC 14443 Type B secure transponder IC family. EEPROM Nonvolatile memory. EGT Extra Guard Time. EOF End of Frame. ePad Exposed thermal pad on surface mount package. ...
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... Seconds. S Slot Number. A code sent to the PICC with Slot-MARKER command. SMD Solder Mask Defined. SPI Serial Peripheral Interface. Serial communication protocol. SRAM Static Random Access Memory. Volatile memory. SRF Self-Resonant Frequency. A capacitor acts short at the SRF frequency. t Time. T Thickness. Tag A PICC with loop antenna attached in a non-plastic credit card form ...
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Appendix F. Standards and Reference Documents International Standards AT88RF1354 is designed to comply with the applicable requirements of the following ISO/IEC standards for Type B PCDs operating at the standard 106 kbps data rate. ISO/IEC 10373-6:2001 Identification Cards – Test ...
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Appendix G. Errata G.1. ATD88RF1354 with IDR Hardware Revision Register: $10 Pre-production version, not fully qualified. The SDO pin does not tri-state when SSB is high or when ISEL is low. This causes bus contention in SPI systems and prevents ...
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Appendix H. Revision History Table 6. Revision History Doc. Rev. Date 8547B 03/2009 8547A 09/2008 8547B–RFID–3/09 13.56 MHz Type B RF Reader Specification Update sections 8, 9, 10, 11, Appendix B, and Appendix G. Initial document release. Comments 47 ...
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